Motorola Corporation

Kevin L Kent

Jacqueline D Glomski

Richard H Gosch

Ranvir Singh Solanki

Eric J Gasmann

Kenneth A Tarbell

John Kivlin

Gregory Rahn

A method for manufacturing an electronic device includes placing a plurality of components on a printed wiring board (,), detecting a defect in a component (,) and, in response, producing a defect indication including a defect location on the printed wiring board. Subsequently, additional components are placed on the printed wiring board (,) but placement of all additional components having a location which has a predetermined relation with the defect location is suspended. The defective printed wiring board may then be repaired by a technician who subsequently places the additional components over the defect location. This reduces the need to apply a large amount of heat to the printed wiring board to remove subsequently placed components such as radio frequency shields. This further reduces the possibility of additional defects occurring during repair.

Automatic defect detection and generation of control code for subsequent defect repair on an assembly line

Accuracy of a circuit assembly process (100) is determined by capturing an image (306, 1008) of an assembly formed on a substrate by the circuit assembly process (100), calculating coverage (310, 1012, 1024) of the assembly from the image, and comparing the coverage (312, 1016, 1026) to a threshold.

Method for determining accuracy of a circuit assembly process and

An apparatus (200) and method are provided for testing a nozzle of a pick-and-place system (100). The apparatus (200) includes a reservoir (206) configured to carry a fluid, a membrane (204) covering an opening of the reservoir (206), and a reservoir pressure sensor. The apparatus may further include a processor (118) coupled to the reservoir pressure sensor (208) and an output device (116) coupled to the processor (118). The nozzle (104) is positioned to contact and displace the membrane (204), thus changing the pressure of the fluid within the reservoir (206). The reservoir pressure sensor (208) senses pressure changes within the reservoir (206) and generates a signal that varies in response to the displacement of the membrane. The signal is compared to a predetermined signal to detect whether the nozzle has the proper position, the proper alignment, sufficient vacuum, and other errors affecting pick-and-place systems.

Method of and apparatus for testing a nozzle of a pick-and-place system

A method for adjusting an electronic part template corresponding to an electronic part that is to be placed on a substrate includes capturing an image of the electronic part, calculating a dimension of the electronic part from the image, and adjusting the electronic part template according to the dimension. This dynamic adjustment of the electronic part template helps to reduce excessive rejection rates due to slight mechanical differences among functionally equivalent electronic parts supplied by different suppliers.

Method for adjusting an electronic part template

A heat sinking apparatus that dissipates heat generated by a surface mountable power device, which can be auto picked and placed, comprises a first planar surface, at least one gull wing mounting tab, and at least one connective leg. The at least one connective leg thermally couples the first planar surface to the gull wing tab and all three structures are comprised of a thermally conductive material. When the heat sinking apparatus is coupled to a substrate, heat generated by the surface mountable power device is thermally transferred through a thermal plane of the substrate to the heat sinking apparatus.

Heat sinking apparatus for surface mountable power devices

A carrier/insertion apparatus that has a U channel handle is improved to comprise an insertion portion, a stabilizer plate, and a deflector portion. The substrate that the carrier/insertion apparatus is mounted on comprises a carrier/insertion apparatus interface region that allows the carrier/insertion apparatus to mate thereto. As the carrier/insertion apparatus is slid into place, the deflector portion deflects the substrate a predetermined distance such that the carrier/insertion apparatus can be snapped into place. This arrangement allows for the carrier/insertion apparatus to be mounted on to a substrate without the use of mechanical hardware.

Growing community of inventors

Woodstock, IL, United States of America

Kevin L Kent