Intel Corporation

Kevin Joseph Doran

David W Browning

Md Altaf Hossain

Dong-Ho Han

Chin Lee Kuan

Nagi Aboulenein

Amit Kumar Jain

Sameer Shekhar

Songnan Yang

Kemal Aygun

Zhiguo Qian

David Israel Gonzalez Aguirre

Jose I Parra Vilchis

Yidnekachew S Mekonnen

Bradley Alan Jackson

Stephen H Hall, Jr

Murali Veeramoney

Subramanian Anandaraj

Yu Amos Zhang

Vijay M Rao

Nevin Altunyurt

Royce Fernald

Gabriel C Cox

Rafael De La Guardia González

Shashi Jain

Venkata Rakesh Seethamsetty

Md Altai Hossain

Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.

Embedded bridge substrate having an integral device

A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.

Side mounted interconnect bridges

This disclosure is directed to a system to provide tactile feedback during non-contact interaction. A system may comprise at least display circuitry, sensing circuitry, tactile feedback circuitry and processing circuitry. The processing circuitry may cause the display circuitry to present a user interface. The sensing circuitry may sense when a body part of a user (e.g., a hand, a finger, etc.) is proximate to the user interface and may generate position data based on a sensed position of the body part. The processing circuitry may determine a relative position of the body part with respect to the user interface based on the position data, and may determine if the body part is interacting with the user interface based on the relative position. If it is determined that the body part is interacting with the user interface, the processing circuitry may cause the tactile feedback circuitry to generate directional feedback.

System to provide tactile feedback during non-contact interaction

Methods, apparatus, systems and articles of manufacture are disclosed herein including a monitoring system for a building including an in-wall guide for a drone, the in-wall guide extending behind at least one wall from a first location to a second location and a power delivery circuit in, or adjacent, the in-wall guide.

Apparatus and system for building monitoring

Systems, apparatus, and methods to deploy safety equipment from a drone are disclosed. An example apparatus includes a sensor to gather environmental data and an analyzer in communication with the sensor. In this example, the analyzer is to identify an anchor site based on the environmental data and produce an assessment of stability of the anchor site based on the environmental data and model data. The example apparatus also includes one or more actuators to deploy a securing device in response to the assessment of the analyzer indicating the anchor site is stable and to deploy the safety equipment.

Systems, apparatus, and methods for safety equipment deployment from a drone

In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections adapted to compensate simultaneously for both far-end crosstalk (FEXT) induced by inductive coupling between the transmission line and an adjacent transmission line, and also far-end crosstalk induced by inductive coupling between the vertical electrical interconnect at the far end of the transmission line and an adjacent vertical electrical interconnect electrically connected to the adjacent transmission line. In another aspect of the present description, a microstrip transmission line may have multiple stubby line sections having different resistances and impedances to more gradually transition from to the typically low impedance characteristics of vertical interconnects such as the PTH vias and socket connectors. Other aspects are described.

Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects

Disclosed embodiments may include a circuit having a plurality of data terminals, no more than two pairs of differential data strobe terminals associated with the plurality of data terminals, and digital logic circuitry. The digital logic circuitry may be coupled to the data terminals and configured to use the no more than two pairs of differential data strobe terminals concurrently with the plurality of data terminals to transfer data. Other embodiments may be disclosed.

Configuration of data strobes

Growing community of inventors

North Plains, OR, United States of America

Kevin Joseph Doran