Intel Corporation

Kevin Jeng

Krishna Seshan

Venkatesan Murali

Fay Hua

Ameet S Bhansali

Gay M Samuelson

Albert T Wu

Shou H Chen

Michael J Gasparek

Ching C Lee

Nicholas P Mencinger

Haiping Dun

A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

In one embodiment, the present invention includes an apparatus having a metal layer with a pad disposed above a substrate; and a cap disposed above the metal layer having a first portion to provide for contact with a probe and a second portion to provide a bonding surface, and the cap is electrically coupled to the pad.

Forming a cap above a metal layer

A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

Wire bonding surface and bonding method

Bonding pad structure having an interposed rigid layer

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Cupertino, CA, United States of America

Kevin Jeng