Micron Technology Incorporated

Round Rock Research, LLC

Advanced Memory International, Inc.

Kevin J Ryan

Terry R Lee

Brent Keeth

Troy A Manning

Charles H Dennison

Todd A Merritt

Brian M Shirley

Brett L Williams

Jeffrey S Mailloux

Joseph M Jeddeloh

Durai Vishak Nirmal Ramaswamy

Kirk D Prall

Christopher S Johnson

Robert Quinn

Jeffrey P Wright

Brian L Johnson

Wen Qian Li

Christopher K Morzano

Jeffery W Janzen

Peter B Gillingham

David V James

Chris G Martin

Cormac Michael O'Connell

Bruce Millar

Thomas W Voshell

Yoshikazu Morooka

Wallace E Fister

Kim M Pierce

Henry Stracovsky

Desi Rhoden

Donald N North

Kwang-Ho Cho

Hans A Wiggers

Mike Pearson

David B Gustavson

Miki Matsumoto

Jean Crepeau

Methods, systems, and devices for triple activate command row address latching are described. For instance, a memory device may receive a first activate command that indicates a first set of bits of a row address, a second activate command that indicates a second set of bits of the row address, and a third activate command that indicates a third set of bits of the row address. The memory device may activate a page of memory based on receiving the first activate command, the second activate command, and the third activate command, where the page of memory is addressed according to the first set of bits, the second set of bits, and the third set of bits.

Triple activate command row address latching

The hybrid memory device may include volatile and non-volatile memory cells on a single substrate, or die. The non-volatile memory cells may have ferroelectric capacitors and the volatile memory cells may have paraelectric or linear dielectric capacitors for their respective logic storage components. In some examples, the volatile memory cells may be used as a cache for the non-volatile memory cells. Or the non-volatile memory cells may be used as a back-up for the volatile memory cells. By placing both types of cells on a single die, rather than separate dies, various performance metrics may be improved, including those related to power consumption and operation speed.

Hybrid memory device using different types of capacitors

A hybrid memory device may include volatile and non-volatile memory cells on a single substrate, or die. The non-volatile memory cells may have ferroelectric capacitors and the volatile memory cells may have paraelectric or linear dielectric capacitors for their respective logic storage components. In some examples, the volatile memory cells may be used as a cache for the non-volatile memory cells. Or the non-volatile memory cells may be used as a back-up for the volatile memory cells. By placing both types of cells on a single die, rather than separate dies, various performance metrics may be improved, including those related to power consumption and operation speed.

Hybrid memory device using different types of capacitors and operating method thereof

Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module.

Apparatus and methods for optically-coupled memory systems

An apparatus and method couples memory devices in a memory module to a memory hub on the module such that signals traveling from the hub to the devices have the same propagation time regardless of which device is involved. The hub receives memory signals from a controller over a high speed data link which the hub translates into electrical data, command and address signals. These signals are applied to the memory devices over busses having equivalent path lengths. The busses may also be used by the memory devices to apply data signals to the memory hub. Such data signals can be converted by the memory hub into memory signals and applied to the controller over the high speed data link. In one example, the memory hub is located in the center of the memory module.

System and method for optimizing interconnections of memory devices in a multichip module

Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of 'free space' optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals. In another embodiment, the optical transmitter/receiver unit projects outwardly from the module substrate to provide an unobstructed path for optical signals.

A cache memory system and method includes a DRAM having a plurality of banks, and it also includes 2 SRAMs each having a capacity that is equal to the capacity of each bank of the DRAM. In operation, data read from a bank of the DRAM are stored in one of the SRAMs so that repeated hits to that bank are cached by reading from the SRAM. In the event of a write to a bank that is being refreshed, the write data are stored in one of the SRAMs. After the refresh of the bank has been completed, the data stored in the SRAM are transferred to the DRAM bank. A subsequent read or write to a second DRAM bank undergoing refresh and occurring during the transfer of data from an SRAM to the DRAM is stored in either the second bank or the other SRAM.

Method and system for using dynamic random access memory as cache memory

An improved technique and associated apparatus for timing calibration of a logic device is provided. A calibration test pattern is transferred to a logic device first at a data rate slower than normal operating speed to ensure correct capture of the pattern at the device to be calibrated. Once the pattern is correctly captured and stored, the test pattern is transmitted to the logic device at the normal operating data rate to perform timing calibration. The improved technique and apparatus permits the use of any pattern of bits as a calibration test pattern, programmable by the user or using easily-interchangeable hardware.

Method of timing calibration using slower data rate pattern

An integrated circuit memory device is designed for high speed data access and for compatibility with existing memory systems. An address strobe signal is used to latch a first address. During a burst access cycle the address is incremented internal to the device with additional address strobe transitions. A new memory address is only required at the beginning of each burst access. Read/Write commands are issued once per burst access eliminating the need to toggle the Read/Write control line at the device cycle frequency. Transitions of the Read/Write control line during a burst access will terminate the burst access, reset the burst length counter and initialize the device for another burst access. The device is compatible with existing Extended Data Out DRAM device pinouts, Fast Page Mode and Extended Data Out Single In-Line Memory Module pinouts, and other memory circuit designs. Additionally, a DRAM is provided having both pipelined and burst Extended Data Out modes of operation and the ability to switch between them.

Asynchronously-accessible memory device with mode selection circuitry for burst or pipelined operation

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Eagle, ID, United States of America

Kevin J Ryan