Motorola Corporation

Other

Kevin J Pieper

Sivakumar Muthuswamy

Thomas J Swirbel

Steven Duane Pratt

James L Davis

Robert J Mulligan

Richard J Kolcz

Lara J Martin

James S McKee

Mitra E Geeban

Mark D Newton

Kimberly A Williams

Brian H Lee

Andrew J Butterfield

Roger K Callanan

An interconnect system for use with interposers or chip carriers provides highly efficient area utilization by attaching very small chip components ( ) such as resistors or capacitors to the solder pads ( ) on the underside of a carrier substrate ( ) such that only one end ( ) of the chip component is attached to the solder pad, while the other end ( ) is suspended free in space. When the interposer or chip carrier is soldered to a main printed circuit board, the free end of the chip component is soldered to a corresponding pad on the printed circuit board. The vertically mounted chip components provide an electrical function, such as decoupling, and also provide an electrical interconnection between the interposer and the printed circuit board. The interposer has electrical vias that pass vertically through the substrate from the solder pads to a conductive circuitry pattern on the top side, which also contains an integrated circuit die or an array of larger discrete chip components. Solder spheres ( ) may also be used on some of the solder pads.

Interconnect system having vertically mounted passive components on an underside of a substrate

A communication device is designed to contain the lowest possible level of toxic or hazardous materials, so that when it is eventually disposed of, it will not harm the environment and can be safely recycled. Each component A.sub.1, A.sub.2, . . . , A.sub.n in the communication device has a calculated Component Toxicity Index value. A Product Toxicity Index for the entire communication device is calculated by summing the individual Component Toxicity Index values. The desired outcome is a communication device having a Product Toxicity Index less than or equal to 100. The resulting communication device is referred to as 'environmentally friendly'. The communication device may be a two-way radio (10), and some of the components are a radio transmitter (12), a radio receiver (14), an antenna (16), an amplifier (18), a battery (20) and a housing (22).

Communication device having a reduced level of hazardous substances

A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a ground pad (21), on a first side (10). Component mounting pads are electrically connected by circuit traces (23), through conductive vias (14), to terminal solder pads (16) on the second side (12) of the circuit substrate. Some of the ground pads are connected to a common ground solder pad (17). Likewise, some of the power pads are connected to a common supply voltage solder pad (19). Solder spheres (18) are attached to the solder pads. Discrete electronic components (24) are conductively coupled (26) to the component-mounting pad pairs.

Discrete component pad array carrier

Growing community of inventors

Coral Springs, FL, United States of America

Kevin J Pieper