Intel Corporation

Kevin J Byrd

Khang Choong Yong

Tin Poay Chuah

David Pidwerbecki

Yew San Lim

Mark J Gallina

Steven Lofland

Scott M Mokler

Timothy M Swettlen

Mark Hemmeyer

Ponniah Ilavarasan

Michael Stewart

Khai Ern Ke See

Khai Em Ke See

In embodiments, a device may include a single electromagnetic interference (EMI) shield plate that defines an enclosed area. The EMI shield plate may have an inner surface and an outer surface opposite the inner surface. The device may further include a first printed circuit board (PCB) coupled with the inner surface, wherein the first PCB is within the enclosed area. Other embodiments may be described and/or claimed.

Electromagnetic interference (EMI) shield

Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.

Shielding in electronic assemblies

Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.

Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices

Growing community of inventors

Portland, OR, United States of America

Kevin J Byrd