General Electric Company

Boe Technology Group Co., Ltd.

Ge Infrastructure Technology, LLC

Kevin Henry Janora

Kelly Scott Chichak

Joseph John Shiang

Jie Jerry Liu

James Anthony Cella

Xiaolei Shi

Gautam Parthasarathy

Jeffrey Michael Youmans

James Anthony Ruud

Kyle Erik Litz

Qing Ye

Young Jin Kim

Rajasingh Schwartz Israel

Ri-an Zhao

Srinivas Prasad Sista

Tianji Zhao

Larry Gene Turner

Peter William Brown

Catherine Procik Dulka

David Wesley Sandusky

Anil Raj Duggal

Larry Neil Lewis

Holly Ann Comanzo

Matthew David Butts

Hongyi Zhou

Christian Maria Anton Heller

Oltea Puica Siclovan

Hongbo Cao

RiAn Zhao

Srinivas Pravad Sista

Rajasingh Swartz Israel

A porous electrolyte structure for a solid state battery is provided. The porous electrolyte structure has an interconnected ceramic matrix with a network of open pores disposed throughout a thickness of the porous electrolyte structure. The porous electrolyte structure includes a porosity of about 20% by volume to about 80% by volume. A solid state battery cell including the porous electrolyte structure and a method of making the solid state battery cell are also provided.

Solid state battery, ceramic electrolyte structure and methods of making

Optoelectronic devices with enhanced internal outcoupling include a substrate, an anode, a cathode, an electroluminescent layer, and an electron transporting layer comprising inorganic nanoparticles dispersed in an organic matrix.

OLED devices with internal outcoupling

Embodiments of the present disclosure include organic light emitting diode (OLED) devices having hollow objects configured to scatter otherwise trapped light out of the device, thereby improving the performance of the device. The hollow objects are dispersed in one or more organic layers of the OLED device. The hollow objects may have a similar refractive index to that of air, such that visible light emitted by the emissive layer may contact the hollow objects in the OLED device and may be scattered out of the device. In some embodiments, the hollow objects may be spherical or tubular, and may be sized to be larger than the visible light wavelength spectrum.

OLED devices comprising hollow objects

Optoelectronic devices that have enhanced internal outcoupling are disclosed. The devices include a substrate, an anode, a cathode, an electroluminescent layer, and a hole injecting layer. The hole injecting layer includes inorganic nanoparticles that have a bimodal particle size distribution and which are dispersed in an organic matrix.

The disclosure relates generally to sealed electronic devices. More particularly, the invention relates to electronic devices employing organic devices having a seal. Packages having organic electronic devices are presented, and a number of sealing mechanisms are provided for hermetically sealing the package to protect the organic electronic device from environmental elements.

Sealed organic opto-electronic devices and related methods of manufacturing

Example embodiments relate to a method and apparatus for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously, to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method may include depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path to attain the apparatus. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Dielectric coating for surfaces exposed to high temperature water

Disclosed is a method for reducing electrostatic deposition of charged particles on wetted surfaces that are exposed, periodically or substantially continuously to high velocity fluid flow within a coolant flow path in a nuclear reactor. The method includes depositing a first or base dielectric layer and a second or outer dielectric layer on a conductive surface that forms a portion of a high velocity flow path. The first dielectric layer material is selected to provide improved adhesion and insulation to the conductive surface and the second dielectric layer material is selected to provide suitable adhesion to the first dielectric layer and improved corrosion and/or mechanical resistance in the anticipated operating environment.

Polymers including at least one structural unit derived from a compound of formula I or including at least one pendant group of formula II may be used in optoelectronic devices  

Emissive polymeric materials for optoelectronic devices

The present invention provides a method for the preparation of organic light-emitting devices comprising a bilayer structure made by forming a first film layer comprising an electroactive material and an INP precursor material, and exposing the first film layer to a radiation source under an inert atmosphere to generate an interpenetrating network polymer composition comprising the electroactive material. At least one additional layer is disposed on the reacted first film layer to complete the bilayer structure. The bilayer structure is comprised within an organic light-emitting device comprising standard features such as electrodes and optionally one or more additional layers serving as a bipolar emission layer, a hole injection layer, an electron injection layer, an electron transport layer, a hole transport layer, exciton-hole transporting layer, exciton-electron transporting layer, a hole transporting emission layer, or an electron transporting emission layer.

Method of making organic light emitting devices

The present invention provides electronic devices comprising novel polymer compositions which provide for enhanced device performance. The polymer compositions employed comprise a polymeric component and a novel organic iridium compound comprising at least one cyclometallated ligand and at least one ketopyrrole ligand. The organic iridium compounds used in the polymer compositions are referred to as Type (1) organic iridium compositions and are constituted such that no ligand of the novel organic iridium compound has a number average molecular weight of 2,000 grams per mole or greater (as measured by gel permeation chromatography). In one aspect, the polymeric component may be an electroactive polymer. In one aspect, the present invention provides optoelectronic devices, such as OLED devices and photovoltaic devices. In another aspect, the invention provides OLED devices exhibiting enhanced color properties and light output efficiencies.

Electronic devices comprising organic iridium compositions

The present invention provides electronic devices comprising novel organic iridium compositions which provide for enhanced device performance. The novel iridium compositions employed comprise at least one novel organic iridium compound which comprises at least one cyclometallated ligand and at least one ketopyrrole ligand. The organic iridium compositions employed are referred to as Type (1) organic iridium compositions and are constituted such that no ligand of the novel organic iridium compound has a number average molecular weight of 2,000 grams per mole or greater (as measured by gel permeation chromatography). Type (1) organic iridium compositions are referred to herein as comprising 'organic iridium complexes'. In one aspect, the present invention provides optoelectronic devices, such as OLED devices and photovoltaic devices. In another aspect, the invention provides OLED devices exhibiting enhanced color properties and light output efficiencies.

An in-situ method for repairing a thermal barrier coating deposited on a component that has suffered localized spallation including depositing a ceramic paste on a surface area of the component exposed by the localized spallation, the ceramic paste including a ceramic material in a binder material, the ceramic material including solid zirconia particles, the binder material including a silicone compound. The method also including heating the binder material to yield a repair coating that covers the surface area of the component, the silicone compound promoting the bonding of the solid zirconia particles.

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Schenectady, NY, United States of America

Kevin Henry Janora