Micron Technology Incorporated

Kevin Gustav Werhane

Yoshinori Fujiwara

Jason M Johnson

Daniel S Miller

Christopher Gordon Wieduwilt

Vivek Kotti

Nathaniel J Meier

Yoshiro Riho

Liang Liu

Hiroshi Akamatsu

Minoru Someya

Bin Liu

Takuya Tamano

Tyrel Z Jensen

Dave Jefferson

Jian Long

Toru Ishikawa

Vijayakrishna J Vankayala

Joshua E Alzheimer

Dennis G Montierth

C Omar Benitez

Kari Crane

Christopher S Wieduwilt

David E Jefferson

According to one or more embodiments, an apparatus comprising a plurality of dice latches, dice latch control logic, and a plurality of data input logic is provided. The dice latches are coupled in parallel and latch respective data. The dice latch control logic receives a load control signal and a reset control signal, provides a reset signal and further provides first and second load signals to the dice latches. The reset signal is based on the reset control signal. The first and second load signals are based on the load control signal and the reset control signal. The data input logic each are coupled to a respective one of the dice latches. Each of the data input logic receives a precharge control signal and respective input data and further provides data and complementary data to the respective one of the dice latches.

Apparatuses and methods including dice latches in a semiconductor device

Methods, apparatuses, and systems related to calibrating memory circuitry according to externally provided reference voltage are described. A memory device may include a calibration control logic that at least isolates an internal reference voltage from an internal buffer. The internal buffer may receive and process the externally provided reference voltage instead of command-address signals for calibration purposes.

Apparatus with calibration input mechanism and methods for operating the same

An electronic device includes multiple memory elements including multiple redundant memory elements. The electronic device also includes repair circuitry configured to remap data to the multiple memory elements when a failure occurs. The repair circuitry includes multiple fuse latches configured to implement the remapping. The repair circuitry also includes latch testing circuitry configured to test functionality of the multiple fuse latches. The latch testing circuitry includes selection circuitry configured to enable selection of a first set of fuse latches of the multiple fuse latches for a test separate from a second set of fuse latches of the multiple fuse latches that are unselected by the selection circuitry.

Systems and methods for testing redundant fuse latches in a memory device

An apparatus includes a TM control circuit that is configured to receive address information corresponding to a TM function and compare the address information with an authorized TM list stored in a memory of the apparatus to determine if there is a match. If there is a match, a latch load signal pulse is output. A TM latch circuit programs one or more latches based on the address information and based on the latch load signal pulse. The TM latch circuit decodes information in the one or more latches and, based on the decoded information, outputs a test mode signal to turn on test mode operations in circuits associated with the TM function. The apparatus includes a plurality of TM functions for testing various features of the apparatus and the authorized TM list identifies which of the plurality of TM functions has been authorized for customer use.

Test mode security circuit

Apparatuses, systems, and methods for error correction. A memory device may have a number of memory cells each of which stores a bit of information. One or more error correction code (ECC) may be used to determine if the bits of information contain any errors. To mitigate the effects of failures of adjacent memory cells, the information may be divided into a first group and a second group, where each group contains information from memory cells which are non-adjacent to other memory cells of that group. Each group of information may include data bits and parity bits used to correct those data bits. For example, as part of a read operation, a first ECC circuit may receive information from even numbered memory cells, while a second ECC circuit may receive information from odd numbered memory cells.

Apparatuses, systems, and methods for error correction

A delay circuit is coupled to a memory device. At least a portion of the delay circuit is disposed in one or more memory banks on one or more memory chips of the memory device. The delay circuit is configured to calibrate an asynchronous signal received at each of the one or more memory banks so that the calibrated asynchronous signal has a common timing relationship with a respective internal command signal received at the corresponding memory bank for all of the one or more memory banks on the memory device. The calibrated asynchronous signals are used in various internal test operations to improve testing accuracy.

Asynchronous signal to command timing calibration for testing accuracy

Apparatuses and methods including dice latches in a semiconductor device are disclosed. Example dice latches have a circuit arrangement that include a reduced number of circuits, such as transistors, and provides a compact layout. Operation of example dice latches and other dice latches may be controlled by separately provided control signals for loading and latching of data, and in some examples, for a reset operation. Example layouts include circuit elements aligned along a direction with at least one other circuit element offset from the other aligned circuit elements.

Serial interfaces with shadow registers, and associated systems, devices, and methods are described herein. In one embodiment, a serial interface is an IEEE 1500 interface, such as of an interface die of a high bandwidth memory (HBM) device. The IEEE 1500 interface includes (a) a primary wrapper data register (WDR) configured to store first information received in a first wrapper serial input (WSI) signal, (b) a shadow WDR configured to store second information received in a second WSI signal, and (c) a multiplexer. The multiplexer is configured to (i) receive the first information from the primary WDR, (ii) receive the second information from the shadow WDR, and (iii) output the first information or the second information based at least in part on a control signal input into the multiplexer.

Serial interfaces with shadow registers, and associated systems, devices, and methods

An example fuse error detection circuit configured to receive a first data set from a fuse array during a first fuse data broadcast and to encode the first data set to provide first signature data. The fuse error detection circuit is further configured to receive a second data set from the fuse array during a second fuse data broadcast and to encode the second data set to provide second signature data. The fuse error detection circuit is further configured to compare the first signature data and the second signature data and to provide a match indication having a value based on the comparison between the first signature data and the second signature data.

Apparatuses and methods for fuse error detection

Command/address (CA) pads of a wafer may be coupled with one or more logic circuits of the wafer to support transmission of a test signal between different memory dies of the wafer. A CA pad of a first memory die may be coupled with a repeater circuit in a scribe region of the wafer, and the repeater circuit may be coupled with a corresponding control circuit in the scribe region. These circuits may support repetition of a signal from a probe card to one or more other CA conductive paths of one or more other memory dies of the wafer. The repeater circuit may receive a test signal from the CA pad, which may be coupled with and receive the test signal from the probe card, and may transmit the test signal to another CA pad of another memory die based on a configuration of the control circuit.

Interconnected command/address resources

Memory devices are disclosed. A memory device may include a number of fuses and a number of transmit lines configured to transmit data from the number of fuses. The memory device may also include a number of monitoring circuits. Each monitoring circuit of the number of monitoring circuits is coupled to a transmit line of the number of transmit lines. Each monitoring circuit comprises logic configured to receive the data from the number fuses via the transmit line. The logic is further configured to generate a result responsive to the data and indicative of pass/fail status of the transmit line. Associated methods and systems are also disclosed.

Transmit line monitoring circuitry, and related methods, devices, and systems

Methods, systems, and devices for memory device random option inversion are described. A memory device may use a second set of fuses to selectively invert options associated with a first set of fuses (e.g., blown fuses). The first set of fuses may output a first set of logic states. Option inversion logic circuitry may perform decoding based on a second set of logic states output by the second set of fuses to identify logic states of the second set of logic states that match the first set of logic states. Based on identifying the logic states, the option inversion logic circuitry may select either a logic state of the first set of logic states or an inverted logic state corresponding to the logic state, and store the selected logic state in a latch of the memory device.

Memory device random option inversion

Methods, systems, and devices for testing a die using a segmented digital die ring are described. A segmented digital die ring may include multiple signal line segments, each coupled with a test segment circuit, and a control circuit. A test segment circuit may generate a digital feedback signal that indicates a condition of a respective signal line segment. The control circuit may generate a single output signal, indicative of the condition of the signal line segments. By utilizing digital testing circuitry and a single digital output signal, a layout area of the segmented digital die ring be minimized and a power consumption associated with the testing operation may be reduced.

Segmented digital die ring

A memory device includes a memory bank having multiple addressable groups of memory cells. The multiple addressable groups of memory cells include a primary set of addressable groups and a secondary set of addressable groups. The memory bank has a control circuitry that activates an addressable group with the control circuitry including repair address match circuitry that includes dynamic selection circuitry having multiple first inputs that receive row address values corresponding to the primary set. The dynamic selection circuitry includes one or more second inputs configured to receive one or more fused address values corresponding to the secondary set of addressable groups. The dynamic selection circuitry includes an output configured to selectively transmit a result that is based at least in part on a selection of one or more first inputs and a comparison of the selected one or more first inputs with the one or more the second inputs.

Growing community of inventors

Kuna, ID, United States of America

Kevin Gustav Werhane