Koninklijke Philips Corporation N.v.

Kevin Grayson Wickline

Franciscus Johannes Gerardus Hakkens

Lucas Johannes Anna Maria Beckers

Peter Dirksen

Wojtek Sudol

Godefridus Antonius Harks

Harm Jan Willem Belt

Richard Edward Davidsen

Gerardus Henricus Maria Gijsbers

Edward Theodorus Maria Berben

Pawel Michalski

Yongjian Yu

Heather Beck Knowles

James Paolino

An ultrasound device () is disclosed comprising a transducer arrangement () and an acoustically transmissive window () over said arrangement, said window comprising an elastomer layer () having conductive particles dispersed in the elastomer, the elastomer layer having a pressure-sensitive conductivity, the ultrasound device further comprising an electrode arrangement () coupled to said elastomer layer and adapted to measure said pressure-sensitive conductivity. An ultrasound system and arrangement including such an ultrasound device are also disclosed.

Ultrasound device contacting

An acoustic window layer for an ultrasound array, which layer has an inner surface arranged to face the array and an outer surface arranged to face a patient, and comprising an outer layer comprising a thermoplastic polymer selected from a polyolefin family (TPO) and an elastomer selected from the polyolefin family (POE) blended therein, wherein the outer layer located at the outer surface of the acoustic window layer. In a preferred embodiment the blend comprises a copolymer of ethylene-octene and polymethylpentene. The thermoplastic polyolefin provides the blend with mechanical, chemical stability and low acoustic wave attenuation; whilst the polyolefin elastomer provides a possibility to tune the acoustic impedance of the blend and to further improve its acoustic wave propagation properties.

Acoustic window layer for an ultrasound array

A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of graphite foam impregnated with an epoxy resin. The epoxy resin penetrates the porous foam structure at least part-way into the depth of the graphite foam block and, when cured, provides the backing block with good structural stability. The composite graphite foam backing block is bonded to the integrated circuit of a transducer to provide high thermal conductivity away from the transducer and good acoustic attenuation or scattering of rearward acoustic reverberations.

High porosity acoustic backing with high thermal conductivity for ultrasound transducer array

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Eindhoven, Netherlands

Kevin Grayson Wickline