The Dow Chemical Company

Dow Global Technolgoies LLC

Dow Technology Investments LLC

Other

University of Illinois

Rohm & Haas Electronic Materials LLC

Kevin E Howard

Stephen D Dunmead

Sten A Wallin

Todd R Bryden

Peter C Lebaron

Edward Otto Shaffer, Ii

Dean M Millar

Paul H Townsend, Iii

William G Moore

Lynne K Mills

Stephen J Doktycz

Kevin C Morse

Peter Trefonas, Iii

Brian T Cunningham

Pak-Wing Steve Chum

Jong Keun Park

Selim Yalvac

Leonardo C Lopez

Juan M Garces

Paul Joseph Popa

Madan Mohan Bhasin

Robert A Kirchhoff

Susan J Babinec

Shaofu Wu

James P Godschalx

Larry R Wilson

Jieqian Zhang

Glenn A Eisman

Kishori Deshpande

Richard T Fox

Xuming Chen

John R Moyer

Daniel F Carroll

Jack E Hetzner

Juliana G Serafin

David J Magley

Theresa A Guiton

Steven R Lakso

William C Sumner

Trevor Ewers

Mark A Chartier

Timothy L Allen

Sheila Gombar-Fetner

Joost J M Waeterloos

Gloria G See

Todd M Clarey

Ruseell B Peters, Jr

Scott J Biskupski

Juan M Garc Es

Brian M Banker

Matthew R Kesterson

Jamie L Lovelace

Edward O Ii Shaffer

Ewers Trevor

Paul H Iii Townsend

In one aspect, structures are provided that comprise (a) a one-dimensional periodic plurality of layers, wherein at least two of the layers have a refractive index differential sufficient to provide effective contrast; and (b) one or more light-emitting nanostructure materials effectively positioned with respect to the refractive index differential interface, wherein the structure provides a polarized output emission.

Nanostructure material methods and devices

The fluoropolymer compositions of the present invention generally incorporate ingredients comprising one or more fluoropolymers, an ultraviolet light protection component (hereinafter UV protection component), and optionally one or more additional ingredients if desired. The UV protection component includes a combination of at least one hindered tertiary amine (HTA) compound having a certain structure and a weight average molecular weight of at least 1000. This tertiary amine is used in combination with at least one organic, UV light absorbing compound (UVLA compound) having a weight average molecular weight greater than 500. When the HTA compound and the UVLA compound are selected according to principles of the present invention, the UV protection component provides fluoropolymer compositions with significantly improved weatherability characteristics for protecting underlying materials, features, structures, components, and/or the like. In particular, fluoropolymer compositions incorporating the UV protection component of the present invention have unexpectedly improved ability to resist blackening, coloration, or other de gradation that may be caused by UV exposure. As a consequence, devices protected by these compositions would be expected to have dramatically improved service life. The compositions have a wide range of uses but are particularly useful for forming protective layers in optoelectronic devices.

Optoelectronic devices incorporating fluoropolymer compositions for protection

The present invention provides porous body precursors and shaped porous bodies. Also included are catalysts and other end-use products based upon the shaped porous bodies and thus the porous body precursors. Finally, processes for making these are provided. The porous body precursors comprise a precursor alumina blend capable of enhancing one or more properties of a shaped porous body based thereupon. The need to employ modifiers to achieve a similar result may thus be substantially reduced, or even avoided, and cost savings are thus provided, as well as savings in time and equipment costs.

Porous body precursors, shaped porous bodies, processes for making them, and end-use products based upon the same

The invention relates to silsesquioxane-titania hybrid polymers, wherein the titania domain size is less than about five nanometers. Such polymers are useful, for example, to form anti-reflection coatings in the fabrication of microelectronic devices.

Silsequioxane-titania hybrid polymers

The present invention provides porous body precursors and shaped porous bodies. Also included are catalysts and other end-use products based upon the shaped porous bodies and thus the porous body precursors. Finally, processes for making these are provided. The porous body precursors, comprise one or more topography-enhancing additives, i.e., additives that are capable of at least marginally enhancing one or more of surface area, aspect ratio, pore volume, median pore diameter, surface morphology, etc. Downstream products need not necessarily comprise the topography-enhancing additives in order to exhibit the benefits of their inclusion in the porous body precursors.

This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material.

Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices

Disclosed is an electrically conductive thermoplastic polymer composition comprising a thermoplastic polymer and a synergistic combination of metal fibers and metal-coated fibers, structures made therefrom, and a process to make said compositions and structures.

Electrically conductive thermoplastic polymer composition

A cured polyphenylene polymer having a glass transition temperature no greater than 465&deg; C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-m .

Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers

The invention is a process for the preparation of coated nitride powder, comprising contacting one or more metal complex(es), organo-aluminum material, optionally one or more silicon compounds or mixtures thereof, with nitride powder under conditions such that coated nitride powder is formed. A metal complex is a metal-containing system which is soluble in a host liquid. The process of the invention is a process for making coated nitride powder and obtaining the desirable properties of coated nitride powder, while maintaining the desirable properties of the uncoated powder, such as good thermal conductivity, for use in electronic applications. In another aspect, the invention is a coated nitride powder which has the advantageous properties of the uncoated powder and is a desirable alternative to current nitride coatings.

Method of preparing coated nitride powder and the coated powder produced

Aluminum nitride powder, aluminum nitride platelets, powdered solid solutions of aluminum nitride and at least one other ceramic material such as silicon carbide, and composites of aluminum nitride and transition metal borides or carbides are prepared by combustion synthesis at low gaseous nitrogen pressures. Porous bodies of aluminum nitride or composites of aluminum nitride and transition metal borides or carbides are also prepared by combustion synthesis at these pressures. The porous bodies are suitable for infiltration, either as formed or after being coated with at least one layer of a silicate material, by polymers or metals. The powders are also suitable for preparing dense sintered bodies. The aluminum nitride powder is also used to prepare AlN sintered bodies.

Aluminum nitride, aluminum nitride containing solid solutions and

Semiconductor devices are encapsulated in a thermosetting resin filled with aluminum nitride particles. The aluminum nitride particles have an outer layer of Al-O-N, into which is incorporated amorphous Si-O, which renders them hydrolyrically stable. The aluminum nitride particles impart very high thermal conductivity to the cured resin. In addition, the cured resin has a CTE similar to that of the encapsulated semiconductor device, and has excellent dielectric properties.

Semiconductor devices encapsulated with aluminum nitride-filled resins

A method for making a moisture-resistant aluminum nitride-containing powder which includes (a) coating a layer of silicate onto aluminum nitride-containing powder having aluminum nitride on at least a portion of its surface and (b) heat-treating the coated aluminum nitride-containing powder at a temperature of from 350.degree. to 1000.degree. C. for a period of time sufficient to cause the silicate to react with the surface aluminum nitride thereby forming a layer of Si--Al--O--N bonded to the surface aluminum nitride. The silicate has alkyl or alkoxyalkyl radicals attached thereto. The method yields a moisture-resistant aluminum nitride-containing powder having a layer of Si--Al--O--N reaction-bonded to the surface aluminum nitride.

Method of making moisture resistant aluminum nitride powder and powder

A process of preparing a crystalline porous solid selected from silicas and metallosilicates, such as, aluminosilicate zeolites or clathrasils. The process involves preparing a reaction mixture containing ammonia; water in a controlled concentration; a (hydrocarbyl)ammonium polysilicate hydrate salt; a mineralizer, such as ammonium fluoride; optionally, a source of a metal oxide, such as aluminum nitride; and optionally, a source of a charge-balancing cation or a structure directing agent; and maintaining the mixture at a temperature and for a time so as to produce the crystalline porous solid. A novel silica which is isostructural with zeolite P1 is prepared. Also prepared are a novel silica which is isostructural with zeolite beta and a novel TMA sodalite having a silica/alumina molar ratio between 12 and about 20.

Synthesis of crystalline porous solids in ammonia

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Midland, MI, United States of America

Kevin E Howard