Commscope Technologies LLC

Kevin E Craig

David C Davies

Michael Pollman

Stephen Ledingham

Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.

Thermal management for modular electronic devices

MIMO antenna modules and antenna units for a wireless communication system are provided. In one embodiment, a remote unit comprises: a controller module, comprising: a first substrate having a first ground plane, control circuitry and interface circuitry on the first substrate, a first connection region formed in the first substrate; and at least one antenna module coupled to the controller module, the antenna module comprising: a second substrate having a second ground plane, antennas on the second substrate, a second connection region on the second substrate and coupled to the interface circuitry via the first connection region, wherein the second connection region communicates data between the interface circuitry and the antennas, and a set of ground-plane contacts on the second substrate that electrically couple the first ground plane to the second ground plane of the second substrate when the second connector region is engaged with the first connector region.

MIMO antenna module and MIMO antenna unit for distributed antenna system

An embodiment of an antenna module includes a substrate, a first antenna, and a second antenna. The first antenna is disposed on the substrate and is configured to radiate a first signal having a wavelength and a first polarization. And the second antenna is disposed on the substrate and is configured to radiate a second signal having the wavelength and a second polarization that is approximately orthogonal to the first polarization. For example, such an antenna module can include, as the first antenna, a T antenna configured to transmit and receive data that forms a first part of a MIMO-OFDM data symbol, and can include, as the second antenna, an F antenna configured to transmit and receive data that forms a second part of the MIMO-OFDM data symbol.

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.

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Dudley, MA, United States of America

Kevin E Craig