Avx Corporation

Kevin D Christian

Gheorghe Korony

John L Galvagni

Yong-Jian Qui

Sonja Brown

Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Precision laser adjustable thin film capacitors

Disclosed are methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that a plurality of lower valued capacitors corresponding to the lower steps of the ladder, and lesser numbers of capacitors, including a single capacitor, for successive steps of the ladder, are provided. Precision capacitance values can be achieved by either of fusing or ablating selected of the fusible links so as to remove the selected subcomponents from the parallel connection. In-situ live-trimming of selected fusible links may be performed after placement of the capacitor array on a hosting printed circuit board.

Method for laser adjustable thin film capacitors

An ultra wideband frequency compensated resistor and related methodologies for frequency compensation are disclosed. In exemplary configuration, a resistive layer is provided over a substrate, and a frequency compensating structure is provided over at least a portion of the resistive layer and separated therefrom by an insulative layer. In certain embodiments, the insulating layer may be an adhesive that may also be effective to secure a protective cover over the resistive material and supporting substrate. In selected embodiments, the frequency compensating structure corresponds to a plurality of conductive layers, one or more of which may be directly electrically connected to terminations for the resistive material while one or more of the conductive layers are not so connected.

High frequency resistor

A method of manufacturing solid state capacitors involves providing an elongate band of solid state forming metal, folding the band into a trough-like U-shaped configuration, introducing a layer of solid state metal powder into the trough, sintering the powdered metal to thereby bond the metal to the foil, partially severing the foil and sintered powder to define a multiplicity of individual units which are thereafter processed to convert the units into capacitors by sequential dielectric forming and counterelectrode depositing steps. The individual capacitors are terminated and preferably also may be tested while still interconnected by portions of the foil, following which individual capacitors are separated by cuts which register with the initial cuts which defined the individual units. The disclosure further teaches a novel solid state capacitor fabricated in accordance with the method, the capacitor exhibiting high volumetric efficiency and being particularly adapted for surface mounting.

Growing community of inventors

Myrtle Beach, SC, United States of America

Kevin D Christian