Stmicroelectronics (research & Development) Limited

Stmicroelectronics S.a.

Stmicroelectronics R&d Limited

Stmicroelectronics Gmbh

Stmicroelectronics (rousset) Sas

Kevin Channon

James Peter Drummond Downing

Andy Price

Christopher Townsend

Thineshwaran Gopal Krishnan

Neale Dutton

Xiaoyong Yang

Rémi Brechignac

Eric Christison

Juan Exposito

Brendan Dunne

Jean-Luc Diot

Robert Nicol

Eric Chistison

Enrico Giuseppe Carnemolla

The present disclosure is directed to a device configured to act as a flood illuminator and a dot projector. The device utilizes a dual channel light source configured to switch between first and second polarizations, and a polarization sensitive metaoptic that outputs dot projection and flood illumination in response to receiving the first polarization and the second polarization, respectively.

Flood and dot emitter

Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.

Wafer level microstructures for an optical lens

An apparatus comprises an array of vertical-cavity surface-emitting lasers. Each of the vertical-cavity surface-emitting lasers is configured to be a source of light. The apparatus also comprises an optical arrangement configured to receive light from a plurality of the vertical-cavity surface-emitting lasers and to output a plurality of light beams.

Apparatus providing a plurality of light beams

An image projection device, such as a pico projector or LCD projector, includes image projection circuitry configured to generate a light beam having a power. The image projection circuitry projects the light beam onto and focuses the light beam on a projection surface located an imaging distance from the image projection circuitry. A time-of-flight sensor is configured to sense the imaging distance between the image projection circuitry and the projection surface and to generate an imaging distance signal indicating the sensed imaging distance. Control circuitry is coupled to the image projection circuitry and to the time-of-flight sensor and is configured to adjust the power and the focus of the light beam based upon the imaging distance signal.

Time of flight sensing for brightness and autofocus control in image projection devices

An apparatus includes a camera module configured to generate at least one image and a ToF SPAD based range detecting module configured to generate at least one distance determination to an object within a field of view of the camera module. A processor receives the at least one image from the camera module output and receives the at least one distance determination from the ToF SPAD based range detecting module. This data is processed by the processor to determine a depth map.

Apparatus for making a distance determination

A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

Method of manufacturing an image sensing micromodule

A semiconductor packaging unit mounts onto a board by solder joints. The unit includes, disposed along one axis, a semiconductor component having on a rear face protruding electrical connection lugs designed to be soldered onto the board and an external cage surrounding the component and having a rear edge designed to be soldered onto the board and a front part through which a front part of the component passes. The component and the cage are designed to axially slide with respect to one another in such a manner as to be brought into their soldering position with respect to the board and having complementary holding parts coming into contact and designed to hold them with respect to one another when they are axially removed from the soldering position and to free them with respect to one another when they are at the soldering position.

Semiconductor packaging unit with sliding cage

A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

Growing community of inventors

Edinburgh, United Kingdom

Kevin Channon