International Business Machines Corporation

Kevin C Quandt

Leendert M Huisman

Kevin J Barcomb

Ulrich Alfons Finkler

Gary William Maier

Robert Edward Shearer

Mark F Olive

A method for analyzing test data for objects on an IC or a wafer is provided. The test data is linked to available layout information about the object under test. Certain objects are selected based on the test data. A representation of the selected objects is placed on a map of the IC or on a map of the wafer. The representation should correspond to the physical location of the object on the IC or wafer. Preferably, the representation comprises one or more polygons that enclose all devices that make up the object.

Rapid fail analysis of embedded objects

A structure and method for identifying a physical location of a defect in a logic circuit based on a physical location of a logic latch having failing data. The logic circuit includes a plurality of logic latches, each having a predetermined physical location within the logic circuit. The logic latches are connected to devices adjacent the logic latches, such that the failing data in the logic latch indicates a failure of a device adjacent the logic latches.

Rapid defect analysis by placement of tester fail data

A method and system for generating memory array bitmaps is disclosed that uses the memory binary address and failing memory data bits collected during test of a chip as input and translates this input directly to physical location in physical design formats which uses memory and a logical to physical server in an electronic computer aided design system.

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Milton, VT, United States of America

Kevin C Quandt