Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Compaq Computer Corporation, Inc.

Compaq Information Technologies Group, L.p.

Kevin B Leigh

John Norton

George D Megason

Paul Kessler Rosenberg

Sagi Varghese Mathai

Everett R Salinas

John Robert Grady

David W Sherrod

Michael Renne Ty Tan

Arlen Lee Roesner

Sunil Ganta

David M Olson

Wayne V Sorin

Marco Fiorentino

John P Franz

Mir Ashkan Seyedi

Joseph R Allen

Paul R Culley

Andrew Brown

Michael R Krause

Sunil Rao Ganta Papa Rao Bala

Kurt A Manweiler

Alan L Goodrum

Kevin G Depew

David R Wooten

Jeffrey R Hilland

David F Bolognia

Christopher C Wanner

Daniel Nathan Cripe

Christopher E Simonich

John M Wastlick

Guodong Zhang

Jason Douglas Jung

Craig A Miller

Tuan A Pham

Luca Ramini

Peter Lieber

Robert Brett Costley

Michael Y Chan

Terrel L Morris

Di Liang

Michael L Chan

Keith J Kuehn

Theodore F Emerson

Kuang-Yi Wu

Wade David Vinson

Steven W Trovinger

Gary W Thome

David F Heinrich

Harvey John Lunsman

Jeffrey Clifford Mogul

Vincent Hung Nguyen

Steven J Dean

Thomas T Hardt

Geza Kurczveil

Robert J Hastings

William J Walker

Belgie B McClelland

Michael Lawrence Sabotta

Dwight L Barron

Praveen Yalagandula

Brian T Purcell

Stanley Cheung

Jayaram Mudigonda

Georgios Panotopoulos

Paily T Varghese

Vincent W Michna

Chong Sin Tan

John D Nguyen

Ashkan Seyedi

Matthew E Stevens

Chih C Shih

Darrel G Gaston

Timothy A McCree

Binh Nguyen

Albert H Chang

Stephen Kay

Doron Chosnek

Richard Barnett

Brandy Dauenhauer Sausse

Eugene E Freeman

Erin Hallinan

Gregory L Gibson

Jason W Whiteman

James R Duncan

Jonathan E James Ou

Miles B Reyes

Nicolas G McDonald

Thomas P Jasso

Bruce A Noe

Sarah Anthony

Timothy S McCann

George D Magason

Jonathan E JamesOu

Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

Switch sub-chassis systems and methods

Techniques and systems for a semiconductor laser, namely a grating-coupled surface-emitting (GCSE) comb laser, having thermal management for facilitating dissipation of heat, integrated thereon. The thermal management is structured in manner that prevents deformation or damage to the GCSE laser chips included in the semiconductor laser implementation. The disclosed thermal management elements integrated in the laser can include: heat sinks; support bars; solder joints; thermal interface material (TIM); silicon vias (TSV); and terminal conductive sheets. Support bars, for example, having the GCSE laser chip positioned between the bars and having a height that is higher than a thickness of the GCSE laser chip. Accordingly, the heat sink can be placed on top of the support bars such that heat is dissipated from the GCSE laser chip, and the heat sink is separated from directed contact with the GCSE laser chip due to the height of the support bars.

Thermal management for hybrid lasers

A computing system includes an array of compute module racks, each compute module rack containing a plurality of compute modules and each compute module being accessible by extracting the compute module rack out of the array of compute module racks. A liquid distribution infrastructure comprising liquid coolant supply lines and return lines is arranged in a first plane adjacent to the array of compute module racks and coupled to each of the vertical racks to provide liquid cooling for the plurality of compute module racks. A power distribution infrastructure comprising power supply lines is arranged in a second plane adjacent to the array of compute module racks and coupled to each of the compute module racks. An optical interconnection infrastructure comprising optical fiber cables is arranged in a third plane adjacent to the array of compute module racks and coupled to each of the compute module racks.

Contiguous plane infrastructure for computing systems

Examples described herein relate to cooling system for an electronic circuit module. The cooling system includes a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls. The cooling system further includes a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates includes one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module. Further, the one or more cold plates of the plurality cold plates include a guide feature to allow vertical movement of the one or more cold plates in respective compartments.

Cooling system for an electronic circuit module

Example implementations relate to an electrical socket for an electronic packaging assembly, which accepts a modular integrated circuit (IC) on one side and a circuit board on another side. In some examples, the electrical socket has a first body mountable on a first surface of the circuit board and a second body mountable on a second surface of the circuit board. The first body includes a plurality of conductors (wire-terminated contacts), where each first conductor includes a first end to protrude beyond the first surface of the circuit board and a second end to protrude beyond the second surface of the circuit board. The second body includes a plurality of receptacles, where each receptacle is coupled to the second end of a respective first conductor.

Electrical socket having a plurality of wire-terminated contacts

Waveguide shuffle blocks (WSBs) are provided that may incorporate waveguides routed in any pattern to effectuate many-to-many connectivity between optical cables/fibers or other WSBs connected thereto. Such WSBs may be configured in ways that allow the WSBs to be stacked and to achieve effective optical cable/fiber organization. Moreover, such WSBs may include readable tags that can provide information regarding a particular WSB configuration and/or what optical cables/fibers are connected so that network topology can be discovered and monitored. Some WSBs may be configured as wavelength shifting shuffles (WSSs) that allow a particular wavelength(s) of an optical signal(s) to be routed as desired and/or alter a first wavelength associated with a particular optical signal to a second wavelength. In other embodiments WSSs can be configured to allow for wavelength multiplexing/demultiplexing.

Stackable waveguide shuffle blocks and systems and methods of identifying same

A system that may be used for deploying optical cables, the system may include a track having an outer edge and a surface, the track having a track gear disposed proximate the outer edge and a plurality of track grooves disposed on the surface of the track. The system may also include a spool having a first outer edge and a second outer edge. The spool may include a first wheel disposed on the first outer edge, a second wheel disposed on the second outer edge, a spool gear disposed on the first wheel and interfacing with the track gear, plurality of spool grooves, and a plurality of guides interfacing with the track to align the track grooves with the spool grooves.

Systems and methods for deploying optical cables

A lock mechanism for a faceplane infrastructure coupled externally from a faceplate of a modular device includes a locking bar, a locking bar engagement element, and a securing device. When the lock mechanism is assembled and in a locked state, the locking bar is housed within the modular device. Further, when the lock mechanism is assembled and in the locked state, the locking bar engagement element is fixedly coupled to a first portion of the faceplane infrastructure and removably engaged with the locking bar through an aperture in the faceplate of the modular device. Moreover, when the lock mechanism is assembled and in the locked state, the securing device locks the first portion of the faceplane infrastructure to the faceplate of the modular device.

Lock for faceplane infrastructure

A computing system comprises a module cage for containing a system board and a plurality of pluggable modules, the module cage having a front face, the pluggable modules arranged in at least two rows of pluggable module locations extending parallel to the front face within the module cage. A layered module locking system including a sliding front locking handle and a sliding rear locking handle is provided. The sliding rear locking handle extending beneath the front locking handle. The sliding locking handles each includes at least one locking feature for slidably engaging with at least one foot of a pluggable module.

Multi-row pluggable high-radix modules

Scalable-bandwidth aggregation boxes are disclosed that allow scalable electrical connection bandwidth of multiple servers in a rack to aggregation modules and compact bifurcatable optical cables to connect the aggregation modules to switches, while minimizing switch faceplate connector area requirements by using optical connectors. Users of a system including scalable-bandwidth aggregation boxes can choose a desired bandwidth cable to connect a server to a switch via an aggregation box. An aggregation box may include a scalable-bandwidth electrical connector on a faceplate, signal lines coupled between the scalable-bandwidth electrical connector and a board connector in the housing, and a serviceable bandwidth-aggregation module removably disposed in the housing.

Scalable-bandwidth aggregation for rack-scale servers

A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.

Computing device

Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

Electronic devices packaged on wing boards

An optical midplane includes an airframe having a first side on which first modules are disposed and a second side on which second modules are disposed. The airframe is to provide for optimized airflow through the first modules disposed on the first side. A plurality of optical connectors are disposed at respective locations on the airframe to provide optical connectivity. Optical connectivity is provided between at least one of any first module disposed on the first side of the airframe and any second module disposed on the second side of the airframe, any first modules disposed on the first side of the airframe, and any second modules disposed on the second side of the airframe.

Airframe-integrated optical midplane

Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.

Rigid-plane optical jumper for pluggable optical transceivers

Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. The pluggable optical transceiver modules include an on-board application-specific integrated circuit (ASIC), optical transceiver, and an optical socket allowing a fiber to connect to the optical transceiver. Pluggable optical transceiver modules implement an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in manner that does not require the fiber jumper, while ensuring tight alignment tolerances. In some embodiments, optical transceiver modules are designed to achieve a direct opt-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, an adaptor is distinctly designed, directly connecting an external cable to the optical socket (eliminating the use of fiber jumper and faceplate connector in the module). In some embodiments, a rigid body opto-mechanical interface is used.

Direct opto-mechanical connection for pluggable optical transceivers

Growing community of inventors

Houston, TX, United States of America

Kevin B Leigh