Intel Corporation

Kevin B George

Kris Frutschy

Kyle Kippes

Kristopher J Frutschy

Sudarshan V Rangaraj

Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.

Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method

An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

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Chandler, AZ, United States of America

Kevin B George