Apple Inc.

Intel Corporation

Allergan, Inc.

Apollo Endosurgery, Inc.

Kevin A Sawyer

William J Kozlovsky

Yazan Z Alnahhas

Andrew J Daiber

Moshe Kriman

Adar Magen

Martin B Adamcyk

Hannah D Noble

Yu Qiao Qu

Xiaofeng Fan

Robert T Stone

Matthew Pease

Neil MacKinnon

William B Chapman

Weiping Li

Chin Han Lin

John E Sell

David Ross Pace

Venkataram R Raju

Gregory S Mast

Khiem Do

Raymond Kono

Rodrigo De La Torro

Dyan Seville-Jones

Bal Gupta

Matthew L Pease

Gregory M Mast

An optical module includes first and second transparent substrates and a spacer between the first and second transparent substrates, holding the first transparent substrate in proximity to the second transparent substrate, with first and second diffractive optical elements (DOEs) on respective faces of the first and second transparent substrates. At least first and second capacitance electrodes are disposed respectively on the first and second transparent substrates in proximity to the first and second DOEs. Circuitry is coupled to measure changes in a capacitance between at least the first and second capacitance electrodes.

Capacitive DOE integrity monitor

An optical module includes a transparent substrate and a refractive optical element mounted on the substrate. A conductive heating trace is deposited on the substrate around the refractive optical element. A temperature sensor senses a temperature of the substrate. Control circuitry is coupled to the temperature sensor so as to measure a difference between the temperature of the substrate and a target operating temperature of the module, and to drive a current through the conductive heating trace, responsively to the difference, so as to heat the substrate to the target operating temperature.

Integrated optical modules with enhanced reliability and integrity

A method for production of an optoelectronic device includes fabricating a plurality of vertical emitters on a semiconductor substrate. Respective top surfaces of the emitters are bonded to a heat sink, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters. Both anode and cathode contacts are attached to the bottom surfaces so as to drive the emitters to emit light from the bottom surfaces. In another embodiment, the upper surface of a semiconductor substrate is bonded to a carrier substrate having through-holes that are aligned with respective top surfaces of the emitters, after which the semiconductor substrate is removed below respective bottom surfaces of the emitters, and the respective bottom surfaces of the emitters are bonded to a heat sink.

High-efficiency vertical emitters with improved heat sinking

A remotely adjustable gastric band system is provided. The system includes a gastric band, an implantable fluid reservoir, and a fluid handling device including a piezoelectric pump, and a drive or controller assembly. The piezoelectric pump includes a diaphragm having a compressible spring positioned at an actuator side of the diaphragm, and a space occupying layer disposed between the compressible spring and the actuator side.

Implantable pump system

A chip carrier having improver thermal properties, wherein the chip carrier may be formed having waist section, and a first transverse end portion joined to the waist section. A first surface of the carrier being configured to receive a chip thereon, and a second surface of the carrier configured to be coupled to a thermal control unit to provide cooling of the carrier and chip. The chip carrier may have a second transverse end portion joined to the waist portion in certain embodiments.

Chip carrier apparatus and method

A micro optical bench for mounting precision aligned optics thereon, and an assembly of precision aligned optical components mounted on an micro optical bench.

Micro optical bench for mounting precision aligned optics, optical assembly and method of mounting optics

Growing community of inventors

Cupertino, CA, United States of America

Kevin A Sawyer