Samsung Electronics Co., Ltd.

Keung-beum Kim

Yong-hoon Kim

Hee-Seok Lee

In-Ho Choi

Yun-seok Choi

Ye-chung Chung

Kyoung-sei Choi

Kyong-Soon Cho

Jae-Hyok Ko

Kwan-Jai Lee

Chang-Su Kim

According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels. The at least one source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and configured to provide the source driving signal to source lines of the plurality of pixels.

Source driver, an image display assembly and an image display apparatus

An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

Provided is a semiconductor package including a semiconductor chip having one surface on which chip pads are formed, and a redistribution structure formed on the one surface of the semiconductor chip. The redistribution structure includes a redistribution layer connected to the chip pads and a redistribution insulating layer interposed between the semiconductor chip and the redistribution layer. The redistribution insulating layer includes a first insulating portion having a first dielectric constant and a second insulating portion having a second dielectric constant that is different from the first dielectric constant. The first insulating portion and the second insulating portion are connected to each other in a horizontal direction.

Semiconductor package

A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

Semiconductor device, semiconductor package, and electronic device

A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.

Growing community of inventors

Suwon-si, South Korea

Keung-beum Kim