Intel Corporation

Microsoft Technology Licensing, LLC

Ketan R Shah

Eric DiStefano

James G Hermerding, Ii

Tawfik M Rahal-Arabi

Thomas J Wong

Katherine Bailey

Anthony James Hewett

Neal E Ulen

Scott Jeffrey Korn

James Alec Ishihara

Peter A Davison

Todd David Pleake

Jay Michael Fassett

Jazmine Ama Hoyle

Patrick Thomas Gaule

Woo Ram Lee

Ibrahim Iskender Kushan

Yauhen Radzikevich

Wenzhao Zhang

Keith Walter Kaatz

Nicolas Jean-Claude Schmitt

Sean M Halton

Stephen H Gunther

Karsten Aagaard

Jeremy J Shrall

Russell S Aoki

David Carter Vandervoort

Zhiqiang Liu

Kazimierz L Kozyra

Sridhar Canumalla

Cesar Ambriz Rios

Christopher Alan Schafer

Kashyap Adury

George Karavaev

Eric Mun Khai Leong

Ryan Travis Evans

Bernard Maurice Schultz, Iii

Yajing Liu

Mark Gerard Rice

Sudeendra Durgappa

Joseph S Alina

Ishfaqur Raza

John Terpsma

Jason Edward Tripard

Benjamin Joseph Carpenter

Alex Sai Cheong Cheng

Katherine Margaret Bailey

Tawfik W Rahal-Arabi

James G Ii Hermerding

A charging system for a peripheral device, such as a stylus, including orientation control. The charging system includes charging circuitry and magnets. The magnets are configured so that they attract the peripheral device to an engagement surface when it is in a first orientation relative to the engagement surface so that charging circuitry in a peripheral device portion couples with charging circuitry in a charger portion. The magnets are configured so that they also repel and rotate the peripheral device when it is in a second orientation relative to the engagement surface.

Charging system including orientation control

An impeller for a centrifugal blower includes at least one blade oriented in a radial direction of the impeller. The blade has an airfoil section with a radially inward end and a radially outward end that are thinner than at least one point between the radially inward end and the radially outward end.

Systems and methods for improving airflow in a centrifugal blower

Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Method and apparatus for configurable thermal management

Aspects of the present disclosure include connection mechanisms for a peripheral computing device to connect with a mobile computing device. The peripheral computing device may include a device interface component that defines part of the connection mechanisms, and an electrical connection protrusion extending from the device interface component and configured to insert in a corresponding electrical receptacle of a computing device. The device interface component may also include a magnetically connectable docking member configured to magnetically attract or to be magnetically attracted to a corresponding docking component on the computing device. The device interface component may further include a support rail configured to support the electrical connection protrusion and the magnetically connectable docking member. The support rail may comprise a shoulder configured to define a pivot point to guide connecting the peripheral computing device with the computing device.

Computing device connection mechanism

The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.

Dimensionally-constrained device faraday cage

A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.

Computing devices with an adhered cover and methods of manufacturing thereof

Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Thermal management for light-emitting diodes

Thermal management devices for a computing device are described herein. A thermal management device includes a layer of a first material included in a dynamic portion of the thermal management device and a static portion of the thermal management device. The dynamic portion of the thermal management device is bendable relative to the static portion of the thermal management device when the thermal management device is physically connected to a display and a chassis of the computing device, and the display rotates relative to a chassis. The layer of material has a first side and a second side. The second side is opposite the first side. The thermal management device also includes a first layer of a second material and a second layer of the second material physically connected to the first side and the second side of the static portion of the layer of the first material, respectively.

Flexible heat spreader

The trackpad assemblies described herein maintain minimum overall stiffness, weight, and cost requirements of a trackpad assembly, while permitting a decrease in trackpad assembly thickness as compared to conventional trackpad assemblies. The trackpad assemblies may include one or more of a four-layer PCB, structural adhesives, a structural PCB stiffener, and a structural shield assembly. These stiffening features permit increasingly thinner trackpad assemblies and associated computing devices.

Rigidly bonded trackpad with structural stiffener

An optical system with a base and an image sensor fixed to the base. The optical system includes a holder fixed to the base about the image sensor. The optical system includes a collar oriented about the image sensor and the holder. The optical system includes a lens barrel oriented about the image sensor, the holder, and the collar. The lens barrel includes at least one lens oriented therein. Two of the holder, collar, and lens barrel are threaded together.

Optical systems and methods of use

Various implementations relating to an illumination package including an edge-emitting laser diode (EELD) are disclosed. In one embodiment, an illumination package includes a heat spreader including a base and a stub that extends from the base, an EELD configured to generate illumination light, the EELD being mounted to a side surface of the stub, and a substrate coupled to the base at a location spaced from the EELD, the substrate being electrically connected to the EELD.

Edge-emitting laser diode package comprising heat spreader

Growing community of inventors

Olympia, WA, United States of America

Ketan R Shah