International Business Machines Corporation

Ketan B Patel

Michael Charles Elles

Tu T Dang

James Scott Womble

Mark G Noll

Anouar Braham

Robert L Ayers

Paul L Anderson

Danny L Woodruff

Embodiments of the present invention provide an approach for protecting electronic devices against the use of unqualified and/or unauthorized (e.g., 'grey market') hardware components. Specifically, in a typical embodiment, a hardware component that a user is attempting to use with an electronic device will be detected. Then, the device information associated with the hardware component (e.g., serial number, vital product data (VPD), etc.) will be identified from the hardware component (e.g., as stored therein).

Protecting an electronic device against unathorized hardware use

A method, computer program product, and computer system for monitoring for electrostatic discharge (ESD) events. An ESD monitor for potential of electrostatic discharge events in a sensed area through a plurality of ESD sensors coupled to the ESD monitor. The monitor senses for a charge level which could cause ESD event and entry of an operator into a sensed area. If an ESD event is detected, issue an ESD event alert to the operator and recording data to a tangible storage device; determine environmental factors at time and date of the ESD event; compare the ESD event and associated environmental factors to other ESD events with associated environmental factors; and determine if a correlation exists between the ESD event and associated environmental factors and the other ESD events with associated environmental factors.

Built-in automated electrostatic discharge monitor for computing units

A dual-sided connector pin interposer includes a substrate comprising a first side opposite a second side. The interposer includes a first plurality of flexible pins protruding from the first side of the substrate. The first plurality of flexible pins is positioned for installation in a first plurality of pad connectors of the pinless socket. The interposer includes a second plurality of flexible pins protruding from the second side of the substrate. The second plurality of flexible pins is positioned for installation in a second plurality of pad connectors of the pinless integrated circuit component. The first plurality of flexible pins are electrically connected to the second plurality of flexible pins through the substrate to provide electrical contact points between the pinless socket and the pinless integrated circuit component when the interposer is installed.

Removable and replaceable dual-sided connector pin interposer

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Raleigh, NC, United States of America

Ketan B Patel