Shanghai Tianma Micro-electronics Co., Ltd.

Shanghai Avic Opto Electronics Co., Ltd.

Tianma Micro-electronics Co., Ltd.

Chengdu Tianma Micro-electronics Co., Ltd.

Shanghai Tianma Am-oled Co., Ltd.

Xiamen Tianma Micro-electronics Co., Ltd.

Shanghai Avic Opto Electronics Co., Ltd. Tianma Micro-electronics Co., Ltd.

Kerui Xi

Feng Qin

Tingting Cui

Baiquan Lin

Zhenyu Jia

Xuhui Peng

Xiaohe Li

Jine Liu

Linzhi Wang

Junting Ouyang

Qinyi Duan

Wei Zhang

Zuocai Yang

Kaidi Zhang

Yunfei Bai

Ping Su

Zhaokeng Cao

Jie Zhang

Qiongqin Mao

Donghua Wang

Xiangjian Kong

Yian Zhou

Boquan Lin

Yifan Xing

Xiaonan Han

Ning He

Bo Tong Liu

Yingru Hu

Zhen Liu

Dengming Lei

Huihui Jiang

Zuzhao Xu

Aowen Li

Yi Wang

Huan Li

Zhonglan Cai

Yuan Yuan Ding

Xiangzi Kong

Jiubin Zhou

Liping Zhang

Yunhua Liu

Shun Gong

Yukun Huang

Qingsan Zhu

Haotian Lu

Guicai Wang

Yajie Wang

Jinyu Li

Xingyao Zhou

Yi Bin Wang

Xiao Ling Chen

Jing Wen Wang

Hong Li

Jun Li

Huijun Jin

Chen Xiao Wang

Fei Li

Min Zhang

Zhiqiang Xia

Ruiyuan Zhou

Xin Xu

Huiping Chai

Dandan Qin

Jing Wang

Juan Zhu

Shoufu Jian

Bojia Lv

Xiaojun Chen

Yuantao Wu

Tinghai Wang

Mingwei Zhang

Ming Xie

Fan Tian

Lingling Zhang

Fei Chen

Jiayin Tang

Jiansheng Zhong

Huanxi Zhang

Jianxin Li

Fan Xu

Xiaobing Zhao

Danping Wang

Luning Yang

Mingyu Wang

Gang Qi

Yifan Bao

Shengwei Dai

Yumin Han

Yewen Wang

Huailing Zheng

Wenqin Xu

Lei Du

Jiongliang Fu

Jinhao Shen

Provided are a sensing circuit and a sensing method thereof, a sensor chip, and a display panel. The sensing circuit includes a first transistor including a first gate and a second gate, a first capacitor, a read circuit, and a bias compensation circuit. The first gate receives a sensing signal outputted by a sensor. The first capacitor is connected between the second gate and a first fixed potential signal terminal. The read circuit is connected between the first transistor and an output terminal of the sensing circuit. The bias compensation circuit is electrically connected to the first transistor and configured to input a bias voltage into the second gate of the first transistor. The bias voltage received by the second gate reduce the threshold voltage drift of the first transistor.

Sensing circuit and sensing method thereof, sensor chip, and display panel

An antenna includes a first base plate. The first base plate has a phase shifter array area and a bonding area. The first base plate includes a first substrate, a first metal layer, and a first conductive layer. The first conductive layer is made of a high-resistance conductive material. The first metal layer includes conductive pads and phase shifter units. At least some conductive pads are in the bonding area, and at least some phase shifter units are located in the phase shifter array area. The first conductive layer includes bias voltage lines, and one conductive pad is electrically connected to a corresponding phase shifter unit through at least one bias voltage line. At least some sections of one bias voltage line partially overlap with one corresponding phase shifter unit, and at least some sections of one bias voltage line overlap with one corresponding conductive pad.

Antenna

An antenna is provided in this application. The antenna includes multiple radiating units, at least two adjacent radiating units are correspondingly provided with a respective decoupling structure, the decoupling structure includes two microstrip line units, one microstrip line unit of the two microstrip line units includes at least one microstrip line, and the two microstrip line units are located on two opposite sides of two radiating units in a direction perpendicular to an arrangement direction of two adjacent radiating units. According to the antenna provided in the embodiments of the present disclosure, the decoupling structure composed of the microstrip line are disposed on two sides of the at least two adjacent radiating units, so that an indirect coupling field is formed by the decoupling structure, and the indirect coupling field counteracts a direct coupling field between adjacent radiating units.

An antenna and its fabrication method, and a display device are provided. The antenna includes a substrate, a radiation electrode, a first dummy electrode, and a feed line. The radiation electrode, the first dummy electrode, and the feed line are disposed on the substrate. The feed line is coupled and connected to the radiation electrode. The first dummy electrode and the radiation electrode are adjacent but not connected to each other. Along a first direction, an orthographic projection of the radiation electrode to a plane where the substrate is located is a first projection, and an orthographic projection of the first dummy electrode to the plane where the substrate is located is a second projection. There is a first interval between the first projection and the second projection; and the first direction is perpendicular to the plane where the substrate is located.

Antenna and its fabrication method, and display device

Provided are a microfluidic apparatus and a manufacturing method thereof. The microfluidic apparatus includes a microfluidic substrate including a base substrate, an electrode array layer located on the base substrate, and a hydrophobic layer, where the electrode array layer includes a plurality of electrodes arranged in an array; and a microfluidic structure layer including at least one microfluidic channel; where the microfluidic substrate is configured to apply a voltage to each of the plurality of electrodes according to the at least one microfluidic channel to drive a droplet in each of the at least one microfluidic channels to move.

Microfluidic apparatus and manufacturing method thereof

A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a second film layer as a flexible film layer. The second film layer at least partially wraps the first film layer. The first film layer includes a first surface and a second surface. The second film layer at least includes a first portion located on a side of the first surface away from the second surface, and a second portion and a third portion located on a side of the second surface away from the first surface. The second portion and the third portion are attached on the second surface through a first adhesive layer and a second adhesive layer, respectively. The second portion and the third portion are spaced apart by a gap.

Prefabricated substrate, flexible substrate, flexible module, fabrication method, and display device

Provided a microfluidic pixel driving circuit includes n boost modules, where each boost module includes a capacitor and a write unit, and n is a positive integer greater than or equal to 2; a first terminal of a first capacitor is electrically connected to a fixed potential line, a second terminal of the first capacitor is electrically connected to a pixel electrode, and the first capacitor is used for storing a voltage of the pixel electrode; a first write unit is configured to write a first data signal to the pixel electrode according to an enable level of a first scan signal; a first terminal of a second capacitor is electrically connected to the pixel electrode; and a second write unit is configured to write a second data signal to a second terminal of the second capacitor according to an enable level of a second scan signal.

Microfluidic pixel driving circuit, microfluidic substrate, and microfluidic chip

A driving circuit, a driving method and a microfluidic substrate are provided. The driving circuit includes a first switching unit, a second switching unit, a reset unit, a first capacitor, and a second capacitor. In a first stage of a driving process of the driving circuit, the first switching unit is turned on, a first voltage signal is transmitted to a first node, the second switching unit is turned on, a second voltage signal is input to an output terminal of the driving circuit, and the driving circuit outputs an AC signal. In a second stage of the driving process, the first switching unit is turned off, the valid signal output by the second scan signal terminal controls the reset unit to be turned on, a third voltage signal is input to the output terminal of the driving circuit for reset, and the driving circuit outputs a DC signal.

Driving circuit, driving method and microfluidic substrate

Provided are a driver board, a display panel, and a display apparatus. The driver board includes a driver circuit. The driver circuit includes N pixel electrodes, N pixel switches, a data switch, and a storage capacitor, N is a positive integer, and N≥2. The storage capacitor includes a reference electrode and a counter electrode. A control terminal of the pixel switch receives a gating signal, a first terminal of the pixel switch is connected to the counter electrode, and a second terminal of the pixel switch is connected to the pixel electrode. The driver board further includes data lines, and each data line is connected to the counter electrode via the data switch.

Driver board, display panel, and display apparatus

A gene sequencing structure, a gene sequencing device and a gene sequencing method are provided. The gene sequencing structure includes a substrate, a thin-film transistor array layer located on the substrate and including thin-film transistors that include a first electrode, and a second electrode; an ion-sensitive layer located on a side of the semiconductor layer away from the substrate; a micro-hole layer located on a side of the ion-sensitive layer away from the substrate, including a through-hole passing through the micro-hole layer, at least partially overlapping the semiconductor layer, and used for receiving a to-be-tested single-stranded nucleic acid inside; a conductive structure, located on a side of the layer away from the substrate and electrically connected to the first electrode or the second electrode; and a detection chip, located on a side of the conductive structure away from the substrate and electrically connected to the conductive structure.

Gene sequencing structure, gene sequencing device and gene sequencing method

A detection device and a detection method are provided. The detection device includes at least one detection unit. The detection unit includes a first transistor, a second transistor, a third transistor and a fourth transistor that are electrically connected to each other, a gate is disposed above a channel of each of the first transistor, the second transistor, and the third transistor, and an ion-sensitive membrane is covered above a channel of the fourth transistor. The detection device also includes a first voltage signal terminal, a second voltage signal terminal, and a third voltage signal terminal. Further, the detection device includes a first power supply terminal, a first potential output terminal, a second potential output terminal, and a second power supply terminal.

Detection device and detection method

A liquid crystal antenna is described. The liquid crystal antenna includes liquid crystal phase shifter units arranged in an array; a first feeding network line corresponding to an iscanning line and extending along a first direction, and/or, a second feeding network line corresponding to an jdata line and extending along a second direction. The first feeding network line is provided between the iscanning line and an (i+1)scanning line, and a scanning line protrusion protrudes toward a side facing away from the first feeding network line corresponding to the iscanning line. The second feeding network line is provided between the jdata line and a (j+1)data line, and a data line protrusion protrudes toward a side facing away from the second feeding network line corresponding to the jdata line.

Liquid crystal antenna

A microfluidic chip and a fabrication method of the microfluidic chip are provided. The microfluidic chip includes an array substrate, and a hydrophobic layer disposed on a side of the array substrate. The hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate. The microfluidic chip also includes at least one hydrophilic structure. A hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole.

Microfluidic chip and fabrication method

Provided are a phase shifter, a preparation method thereof, and an antenna. The phase shifter includes at least one phase shifting unit, and the phase shifting unit includes a microstrip line, a photo-dielectric layer, a ground electrode, and at least one light guiding structure; the microstrip line is located on a side of the photo-dielectric layer, and the ground electrode is located on a side of the photo-dielectric layer facing away from the microstrip line; the light-guiding structure at least partially overlaps the photo-dielectric layer, and the light-guiding structure is configured to guide light into the photo-dielectric layer.

Antenna including at least one microstrip line phase shifting unit having a photo-dielectric layer and a light guiding structure configured to guide light into the photo-dielectric layer

The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.

Package structure, packaging method, camera module, and electronic equipment

Growing community of inventors

Shanghai, China

Kerui Xi