Robert Boschgmbh

Kersten Kehr

Johannes Classen

Axel Franke

Udo-Martin Gomez

Reinhard Neul

Joerg Hauer

Burkhard Kuhlmann

Daniel Christoph Meisel

Torsten Ohms

Oliver Kohn

Hans Artmann

Frank Schatz

Markus Ulm

Ralf Reichenbach

Helmut Sautter

Dietrich Schubert

Lutz Mueller

Juergen Graf

Marco Quander

Marko Rocznik

A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

Yaw-rate sensor

A yaw rate sensor includes a drive mass element which is situated above a surface of a substrate and is drivable to vibrate by a drive device along a first axis extending along the surface, having a detection mass element, which is deflectable under the influence of a Coriolis force along a second axis perpendicular to the surface, and having a detection device by which the deflection of the detection mass element along the second axis is detectable. Due to the arrangement of the second axis perpendicular to the surface, the yaw rate sensor may be integrated into a chip together with additional yaw rate sensors suitable for detection of rotations about axes of rotation in other directions.

Yaw rate sensor

A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, where the movable substructures are excitable into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, where deflections of the Coriolis elements induced by a Coriolis force are detectable, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.

A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.

Multiaxial micromechanical acceleration sensor

A micromechanical component includes an anti-adhesive layer, formed from at least one fluorine-containing silane, applied to at least parts of its surface for reducing surface forces. To increase mechanical and thermal load capacity, the anti-adhesive layer is provided as a multilayer coating which is formed from at least one metal oxide layer and at least one layer composed of at least one fluorine-containing silane.

Micromechanical component and method for producing an anti-adhesive layer on a micromechanical component

A semiconductor component, in particular a micromechanical pressure sensor based on silicon, having a base layer, an at least largely self-supporting diaphragm and an overlayer situated on the diaphragm, the diaphragm and the base layer, at least from place to place, delimiting a void. Furthermore, at least from place to place, above the diaphragm a conducting region is provided in the overlayer which is electrically poorly conductive as compared to the conducting region, to which the surface of the diaphragm that faces the overlayer is able to be electrically contacted.

Semiconductor component, particularly a micromechanical pressure sensor

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Kersten Kehr