Agere Systems Inc.

Kerry Leeds Davison

Yehuda Smooha

Donald Earl Hawk, Jr

An integrated circuit device comprising a die having a top surface with a peripheral region and an interior region surrounded by the peripheral region. Bond pads are disposed in the peripheral region of the die. One or more internal buses are disposed in the interior region of the die. The one or more internal buses distribute power to internal node points of the die. One or more bond wires connect one or more peripheral bond pads with one or more internal buses.

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

An integrated circuit (IC) package includes an IC having at least one ESD protection circuit that provides protection against electrostatic discharge. The IC has a plurality of bond pads that are not coupled to the ESD protection circuit. The IC is connected to a substrate. The substrate has a first plurality of conductive traces, which are connected to respective bond pads of the IC, and a second plurality of conductive traces, which are not connected to any of the plurality of bond pads of the IC. Either the substrate or the IC has a common conductive trace that is connected to the ESD protection circuit. Each of the second plurality of conductive traces is connected to the common conductive trace.

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Allentown, PA, United States of America

Kerry Leeds Davison