Robert Boschgmbh

Kerrin Doessel

Frank Schatz

Joerg Muchow

Thomas Friedrich

Helmut Grutzeck

Simon Armbruster

Thomas Buck

Stefan Leidich

Rainer Straub

Frederic Njikam Njimonzie

Timo Schary

Johannes Baader

Christoph Hermes

Daniel Pantel

Ahmad Mansour

Christoph Schelling

Stefan Pinter

Fabian Purkl

Jochen Franz

Friedjof Heuck

Zoltan Lestyan

Janine Riedrich-Moeller

Ralf Boessendoerfer

Franziska Rohlfing

Thomas Northemann

Fabian Purki

Josip Mihaljevic

Alexander Eberspaecher

A micromechanical device, in particular a micromirror device. The device has at least one first micromechanical component and one second micromechanical component. The first component and the second component are directly or indirectly joined to one another. The first micromechanical component has a first sub-body and at least one second sub-body. The first sub-body extends in a first plane and the second sub-body in a second plane different from the first plane. The first plane and the second plane extend parallel to one another and the first plane extends above the second plane. The second sub-body is arranged in a transitional region to the second micromechanical component. A second extent of the second sub-body in the longitudinal direction is greater than a first extent of the first sub-body in the longitudinal direction.

Micromechanical device

A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.

Micromechanical component and method for producing a micromechanical component

A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit

A MEMS sensor including a diaphragm, a base surface area of the diaphragm being delimited with the aid of a peripheral wall structure, and the base surface area including at least two subareas, of which at least one of the subareas is deflectably situated, and the at least two subareas being separated from one another with the aid of at least one separating structure or being delimited by the latter. The separating structure includes at least one fluid through-opening for the passage of fluid.

MEMS sensor including a diaphragm and method for manufacturing a MEMS sensor

A method for operating a capacitive device. The method includes providing a pulsed readout signal having a pulse frequency at a readout signal channel, to which at least one capacitor unit of the capacitive device is electrically connected, and reading out the at least one capacitor unit of the capacitive device, which has a natural frequency with a natural frequency period duration t, using the pulsed readout signal. Each voltage pulse of the pulsed readout signal is applied to the readout signal channel in n temporally offset voltage stages, n being a natural number greater than or equal to 2, and a time offset &#x394;tis maintained between each two consecutively applied voltage stages in such a way that the following is true for at least one time offset &#x394;tbetween the voltage stages: m being a natural number greater than or equal to zero.

Readout signal generator and method for operating a capacitive device

A micromechanical component having at least one electromechanical flexible structure, each of which includes a first piezoelectric layer, a first outer electrode situated on a first side of the first piezoelectric layer, a first intermediate electrode situated on a second side, oriented away from the first side, of the first piezoelectric layer, a second piezoelectric layer situated on a side of the first intermediate electrode oriented away from the first piezoelectric layer, and a second outer electrode situated on a side of the second piezoelectric layer oriented away from the first intermediate electrode, the at least one electromechanical flexible structure having in each case a second intermediate electrode that is situated on the side of the first intermediate electrode oriented away from the first piezoelectric layer, between the second piezoelectric layer and the first intermediate electrode.

Micromechanical component and production method for a micromechanical component

A micromechanical sound transducer system includes a substrate that includes (a) a cavity with a cavity edge area, (b) a front side, and (c) a rear side; a piezoelectric vibrating beam that is elastically suspended on the front side and that extends across the cavity; and, for the piezoelectric vibrating beam, a respective deflection limiting device that is on a front edge area of the respective vibrating beam and that is configured to limit a deflection of the respective vibrating beam to a limiting deflection by causing the respective front edge area of the respective vibrating beam to interact with the cavity edge area or an opposing front edge area of another vibrating beam.

Micromechanical sound transducer system and corresponding manufacturing method

A method for processing a signal includes reading in a signal and filtering the signal using a first number of band-pass filters in order to obtain one band-pass filtered signal per band-pass filter. The first number of band-pass filters is configured to each allow distinct frequency ranges of the signal to pass. The method further includes calculating at least one signal parameter each from the plurality of band-pass filtered signals. The method further includes performing analog-to-digital conversion of the plurality of band-pass filtered signals or signals derived therefrom using a plurality of signal parameters such that a second number of analog-to-digital converters used to perform the analog-to-digital conversion is less than the first number of band-pass filters used to filter the signal.

Method and device for processing a signal

An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

Assembly body for micromirror chips, mirror device and production method for a mirror device

A mirror system including a mirror that is mounted in a manner that permits oscillation, having a coil and at least one first spring that intercouples the mirror and the coil in a way that allows the coil to be placed as a counterweight to the oscillating mirror. Also a corresponding projection device.

Mirror system and projection device

A micromechanical component and a method for producing a micromechanical component are described. The component has: a frame; a plate spring that is connected to the frame and that has a front side and a rear side facing away from the front side; a mirror element that is situated on the front side of the plate spring and is connected to the front side of the plate spring in such a way that the mirror element is suspended on the frame so as to be capable of displacement; and at least one piezoelectric strip that is connected to the rear side of the plate spring; the plate spring being elastically deformable through the application of an electrical voltage to the at least one piezoelectric strip in order to displace the mirror element.

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Kerrin Doessel