Rohm & Haas Electronic Materials LLC

Meta Platforms Technologies, LLC

Dupont Electronic Materials International, LLC

Keren Zhang

James F Cameron

Shintaro Yamada

Li Cui

Suzanne M Coley

Sheng Liu

Paul J LaBeaume

Iou-Sheng Ke

Daniel Greene

Ankit Vora

Joshua A Kaitz

Deyan Wang

Matthew E Colburn

Ke Yang

Feyza Dundar Arisoy

Alejo Lifschitz Arribio

Anthony Phan

Igor Abramson

Vincent Overney

Jonathan Onorato

Dan B Millward

Compounds having three or more alkynyl moieties substituted with an aromatic moiety having one or more of certain substituents are useful in forming underlayers useful in semiconductor manufacturing processes.

Aromatic underlayer

An optical device includes an overcoat layer on a surface-relief grating. The overcoat layer is formed by a process including: depositing a layer of a first resin material that is curable by heat or electromagnetic radiation on a surface-relief grating that includes a plurality of grating ridges and a plurality of grating grooves to at least partially fill the plurality of grating grooves, curing the layer of the first resin material, depositing a layer of a second resin material that is curable by heat or electromagnetic radiation and has a higher flowability than the first resin material on the layer of the first resin material, annealing the layer of the second resin material to allow the second resin material to flow and form a planar top surface, and curing the layer of the second resin material.

Coating composition and planarization of high refractive index overcoat on gratings

A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14):D-(L-Ar—[X])  (14); anda solvent, wherein, in formula (14), D is a substituted or unsubstituted Corganic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted Corganic group; each Lis independently a single bond or a divalent linking group, when Lis a single bond, D may be a substituted or unsubstituted Ccycloalkyl or substituted or unsubstituted Cheterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic Caromatic group, each X is independently —OR, —SR, or —NRR, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and Rto Rare as provided herein.

Adhesion promoting photoresist underlayer composition

A method of planarizing an overcoat layer on a surface-relief grating includes dispensing a layer of a resin material that is curable by heat or electromagnetic radiation on a surface-relief grating that includes a plurality of grating grooves, pressing the layer of the resin material using a planar imprint stamp, curing the resin material in the layer of the resin material, and detaching the planar imprint stamp from the layer of the resin material. In one example, a thickness of the overcoat layer on top of grating ridges of the surface-relief grating is equal to or less than 20 nm, and a surface peak-to-valley height of a top surface of the overcoat layer is equal to or less than 5 nm.

Techniques for controlling overburden planarization

Various systems and methods relating to a feature fill sol-gel material are provided herein. The feature fill sol-gel material may form a superconformal sol-gel coating. The feature fill sol-gel material may include a first titanium precursor composed of Titanium(IV) and an inorganic ligand. The feature fill sol-gel material may be formed by dissolving or suspending the first titanium precursor in a solvent. The feature fill sol-gel material may be annealed to form the superconformal sol-gel coating. The superconformal sol-gel coating may be an optically transparent coating having an absorbance at a wavelength of 450 nm of less than 0.2% per 150 nm and a refractive index ranging from 1.65 to 2.20.

Superconformal recessed feature fill sol-gels

Coating compositions comprise: a curable compound comprising: a core chosen from a Ccarbocyclic aromatic ring, a Cheterocyclic aromatic ring, a Cfused carbocyclic aromatic ring system, a Cfused heterocyclic aromatic ring system, Caliphatic, and Ccycloaliphatic, and three or more substituents of formula (1) wherein at least two substituents of formula (1) are attached to the aromatic core; provided that no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition.

Coating compositions and methods of forming electronic devices

Polyarylene resins and compositions containing them are useful as underlayers in semiconductor manufacturing processes.

Aromatic resins for underlayers

A method of manufacturing a semiconductor device comprising: providing a semiconductor device substrate having a relief image on a surface of the substrate, the relief image having a plurality of gaps to be filled; applying a coating composition to the relief image to provide a coating layer, wherein the coating composition comprises (i) a polyarylene oligomer comprising as polymerized units one or more first monomers having two or more cyclopentadienone moieties and one or more second monomers having an aromatic moiety and two or more alkynyl moieties; wherein the polyarylene oligomer has a Mof 1000 to 6000 Da, a PDI of 1 to 2, and a molar ratio of total first monomers to total second monomers of 1:&#x3e;1; and (ii) one or more organic solvents; curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to the semiconductor device substrate.

Gap-filling method

Growing community of inventors

Kirkland, WA, United States of America

Keren Zhang