Innolux Corporation

Innocom Technology(shenzhen) Co., Ltd.

Ker-Yih Kao

Chin-Lung Ting

Ming-Chun Tseng

Li-Wei Mao

Chia-Chi Ho

Liang-Lu Chen

Kung-Chen Kuo

Chia-Ping Tseng

I-Yin Li

Shun-Yuan Hu

Yi-Hua Hsu

Chung-Kuang Wei

Hsin-Hung Lin

Ming Chun Tseng

Hung-I Tseng

Ming-Yen Weng

Chih-Yung Hsieh

Cheng-Chi Wang

Cheng-Hsu Chou

Jung-Fang Chang

Tong-Jung Wang

Yi Hung Lin

Huei-Ying Chen

Chien-Hsing Lee

Tang Chin Hung

Hao Jung Huang

Chi-Lun Kao

Po-Yun Hsu

Tsan-Jen Chen

Shu-Ling Wu

Yi-Hung Lin

Lien-Hsiang Chen

Ching-Che Yang

Hao-Jung Huang

Yun-Sheng Chen

Kuang-Ming Fan

Wen-Hsiang Liao

Chi-Che Tsai

Hsin-Yu Lee

Yu-Ju Chen

Min-Hsin Lo

Hung-Sheng Liao

Wen-Lin Huang

Mu-Fan Chang

Tsutomu Shinozaki

Li-Wei Sung

Chi-Liang Chang

Chu-Hong Lai

Chia-Chieh Fan

Ming-Chia Shih

Hsu-Kuan Hsu

Chen-Kuan Kao

Yu-Chih Tseng

Wei-Yen Wu

Chuan-Ming Yeh

Kuo-Shun Tsai

Sheng-Nan Chen

Chao-Chin Sung

Shan-Shan Hsu

Ho-Tien Chen

I-Ho Shen

Fuh-Tsang Wu

Cheng-Fu Wen

Kuo-Sheng Yeh

Yi-Chen Chou

Ming-Hsien Shih

Wen-Chang Tsai

Yu-Yao Chen

Chia-Chun Liu

Chun-Hung Chen

Chiao-Chu Tsui

Chih-Han Ma

Chang-Ching Wu

M-Hua Hsu

Kuo-Chun Lo

Charlene Su

Te-Yi Chen

Han-Tsung Su

Jiun-Ru Tzeng

An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.

Electronic device

An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

Electronic device and method of fabricating an electronic device

An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, multiple light emitting elements, and a light absorbing layer. The light emitting elements are disposed on the substrate. One of the light emitting elements has at least one lateral surface. The light absorbing layer is disposed on the substrate and is located between two adjacent light emitting elements, and the light absorbing layer contacts the at least one lateral surface.

Electronic device with light absorbing layer between light emitting elements and manufacturing method thereof

An electronic device is provided. The electronic device includes a plurality of spacing elements, a first electronic unit and a second electronic unit, a protective layer and a connecting member. The first electronic unit and the second electronic unit are individually disposed between two adjacent spacing elements. The protective layer surrounds the spacing elements, the first electronic unit and the second electronic unit. The first electronic unit is electrically connected to the second electronic unit via the connecting member. In a direction that is perpendicular to a normal direction of the electronic device, the first electronic unit has a first width, and a first distance is between the two adjacent spacing elements. A ratio of the first distance to the first width is greater than or equal to 1 and less than or equal to 1.3. A method of manufacturing an electronic device is also provided.

Electronic device and method of manufacturing the same

The present disclosure provides an electronic device including a substrate, a semiconductor disposed on the substrate, and a conductive layer disposed on the semiconductor. The conductive layer has a first electrode and a second electrode, in which the first electrode is electrically connected to the semiconductor, and the second electrode surrounds the first electrode in a top view direction of the electronic device.

An electronic device includes a first metal layer, a first insulating layer, a second metal layer and a second insulating layer. The first insulating layer is disposed on the first metal layer, the second metal layer is disposed on the first insulating layer, and the second insulating layer is disposed between the second metal layer and the first insulating layer. The second metal layer is electrically connected to the first metal layer through a first opening of the first insulating layer and a second opening of the second insulating layer.

Electronic device having a silane coupling agent in an insulating layer

An operation method of an electronic device for sensing an optical signal is provided. The electronic device includes a plurality of optical sensors and a plurality of light-emitting elements disposed adjacent to the plurality of optical sensors. The operation method of the electronic device for sensing the optical signal includes the following steps. The optical signal is provided to a first optical sensor of the plurality of optical sensors. The first optical sensor outputs a driving signal when dimming the plurality of light-emitting elements adjacent to the first optical sensor. Therefore, the accuracy of sensing the optical signal may be effectively increased.

Operation method of electronic device for sensing optical signal and electronic device

An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

The disclosure provides a light emitting device including a substrate and multiple pixels. The pixels are disposed on the substrate, each of the pixels includes multiple sub-pixels. Two adjacent sub-pixels are separated by a distance D, and one of the two adjacent sub-pixels has a height H. The distance and the height satisfy a relational expression: 0.3H<D≤30H.

Light emitting device

An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrate.

A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Electronic device having bent portion

A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

Manufacturing method of package structure

A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Light-emitting device and tiled display comprising the same

An electronic device includes: a circuit board; a plurality of diodes disposed on a first surface of the circuit board; a plurality of first driving circuits disposed on the first surface of the circuit board and electrically connected to the plurality of diodes; and a plurality of second driving circuits electrically connected to the plurality of first driving circuits, wherein a part of the plurality of second driving circuits are disposed on a first substrate, and another part of the second driving circuits are disposed on a second substrate.

The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

Electronic apparatus and manufacturing method thereof

Growing community of inventors

Miao-Li County, Taiwan

Ker-Yih Kao