Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

Keon-Woo Kim

Gun-Woo Moon

Jin-Ho Kim

Sung Yong Park

Hyun-Bae Kim

Sun-Ho Kim

Eung-Su Kim

Ja-Woo Lee

Songyun Kang

Moo-Hyun Park

Cheon-Yong Lim

Jung-Kyu Han

Bo-Ra Yoon

Seung-Hyun Choi

Hyojin Park

Jong-Woo Kim

Jae-Il Baek

Hyan-Jung Lee

Tae-Il Cho

Disclosed is a substrate polishing method comprising placing a substrate into a substrate polishing apparatus, rotating each of the substrate and a polishing pad of the substrate polishing apparatus, allowing a bottom surface of the substrate to contact a top surface of the polishing pad, and determining whether the polishing pad would benefit from maintenance. The polishing pad includes a plurality of annular regions that are homocentric with a central point of the top surface of the polishing pad. The step of determining whether the polishing pad would benefit from maintenance includes ascertaining a state of the bottom surface of the substrate, and selecting one of the plurality of annular regions by using information about the state of the bottom surface of the substrate. The one of the plurality of annular regions would benefit from maintenance.

Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same

Disclosed is an asymmetrical half-bridge converter having high efficiency in a wide input voltage range. The converter may include a primary-side circuit including a first switch, a second switch, a primary-side capacitor, an additional inductor, and a primary-side magnetization inductor, and a secondary-side circuit including first and second diodes connected in series, first and second capacitors connected in series, a secondary-side rectification inductor having one end connected to the anode of the first diode and cathode of the second diode, and having the other end connected between the first and second capacitors connected in series, a first coupling inductor having one end connected to the cathode of the first diode and having the other end connected to the first capacitor, and a second coupling inductor having one end connected to the anode of the second diode and having the other end connected to the second capacitor.

Half-bridge converter including rectifier structure using coupling inductor

A discrete capacitance switching circuit includes a DC decoupling capacitor connected between a power node that receives an AC signal and a first node, a diode connected between the first node and a second node, a unit capacitor connected between the second node and a reference node that receives a ground voltage, and a bias circuit. The bias circuit is configured to apply a first DC voltage to the first node and apply a second DC voltage to the second node. The applied first and second DC voltages control a switching operation of the diode.

Discrete capacitance switching circuit and capacitor array circuit including the same

A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.

Apparatus and methods for edge ring replacement, inspection and alignment using image sensors

Growing community of inventors

Daejeon, South Korea

Keon-Woo Kim