Stats Chippac Pte. Ltd.

Keon Teak Kang

DongSam Park

A Leam Choi

Jae Han Chung

Bongsuk Choi

An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.

Integrated circuit package system with delamination prevention structure

A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.

Growing community of inventors

Namyangju-si, South Korea

Keon Teak Kang