Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

Sungkyunkwan University

Korea University Research and Business Foundation

Hewlett-packard Development Company, L.P.

Samsung Display Co., Ltd.

Hp Printing Korea Co., Ltd.

Keon Kuk

Yong-soo Oh

Il-ju Mun

Min Soo Kim

Chang-seung Lee

Young-dae Ko

Min-Soo Kim

Tatsuhiro Otsuka

Dae-Hwan Kim

Sang-wook Lee

Jin-han Kim

Seung-Joo Shin

Dong-kee Sohn

Ji-woon Yeom

Woo Hyek Choi

Su-ho Shin

Kyong-il Kim

Yeon-kyoung Jung

Jun-o Kim

Hyeon-Cheol Kim

Seog-Soon Baek

Yong-Soo Lee

O-hyun Beak

Il Ju Mun

Doo-jin Maeng

Jin Han Kim

Young-jae Kim

Jae-sik Min

Seong-jin Kim

Ji-Hyuk Lim

Mun-cheol Choi

Eun-bong Han

Choong Hyo Jang

Seung-joo Shin

Seung-ju Shin

Hoon Song

Dae Hwan Kim

Sang-hyun Lee

Kye-Si Kwon

Jong-cheol Shin

You-seop Lee

Gee-Young Sung

Yeon Kyoung Jung

Ki-deok Bae

Hyung-taek Lim

Seog-soon Baek

Jin-woo Jung

Ji-hyuk Lim

Jun-hyub Park

Seog Soon Baek

Hyun Ku Jeong

Kwang-joon Yoon

Hyeon-hyang Kim

Jun O Kim

Eun Bong Han

Yong Kim

Sang-hoon Lee

Woon-bae Kim

Il Han Park

Jae Jun Lee

Mi-jeong Song

Young-min Cheong

Jin-Han Kim

Jin-seung Choi

Suk-han Lee

Seo-hyun Cho

Seong-taek Lim

Hee-moon Jeong

Young-chul Ko

In-hak Na

Jong-woo Shin

Yong-shik Park

Jun-hee Lee

Hee Moon Jeong

Young-hoon Min

Seong Ho Kil

Inseok Yeo

Tae-Ho Song

Chang-ho Cho

Bang-Weon Lee

Eun-Bong Han

Seok Uk Kim

Yong Hyun Lim

Jong Youb Ryu

Ohyun Beak

Dae Whan Kim

Sung-Kie Youn

Yong Seok Jeon

Jaehyug Lee

Young Dae Ko

Bongsu Choi

Mu-kun An

Kang Wonkyeong

Pilseong Kang

Yeo Inseok

Gil-Eon Jeong

Choi Bongsu

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

Hollow shielding structure for different types of circuit elements and manufacturing method thereof

Provided is a refrigerator including an inner case, a storage compartment formed inside the inner case, an outer case provided outside the inner case, and a plurality of vacuum insulation modules provided between the inner case and the outer case to insulate the storage compartment, and each of the plurality of vacuum insulation modules includes a vacuum insulator, and a cartridge which accommodates the vacuum insulator and supports the inner case and the outer case. The cartridge has a mutual coupling portion coupled to the cartridge of an adjacent vacuum insulation module. Accordingly, the vacuum insulator can be easily manufactured without an additional support frame or a foaming process, and sufficient strength and coupling force can be secured by using only the vacuum insulator.

Refrigerator and vacuum insulation module thereof

A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Semiconductor package and method of manufacturing the same

An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Object forming apparatus and controlling method thereof

A refrigerator having an improved structure configured to increase the energy efficiency includes a main body provided with an inner case and an outer case, a storage compartment formed inside of the inner case, an insulation material provided between the inner case and the outer case to insulate the storage compartment and a flange having the anisotropy having different heat resistance distribution to insulate the storage compartment, together with the insulation material.

Refrigerator

A three-dimensional printer and an operating method are provided. The three-dimensional printer includes at least one print head and a stage in which chemical ink injected from the print head may be layered. The three-dimensional printer includes a print head including a head chip injecting the chemical ink, wherein the head chip may include an ink chamber receiving the chemical ink, a heater generating a bubble in the ink chamber by applying heat to the chemical ink of the ink chamber, and a nozzle injecting the chemical ink according to an internal pressure of the ink chamber increased by the generated bubble.

Three-dimensional printer and operating method for the same

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

EMI shielding structure and manufacturing method therefor

An electronic device having an antenna element is provided. The electronic device includes a printed circuit board on which a plurality of components are mounted, at least one antenna element mounted on the printed circuit board, an insulating dam formed on the printed circuit board and configured to surround the at least one antenna element, and a dielectric part configured to fill an inside of the insulating dam and to support the at least one antenna element.

Electronic device having antenna element and method for manufacturing the same

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

Electromagnetic interference shielding structure

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

Manufacturing method for EMI shielding structure

Manufacturing method of a hollow shielding structure for circuit elements

An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

EMI shielding structure

A magnetic cooling apparatus may include a fixing module and a rotation module rotatably provided at the fixing module. The fixing module includes a plurality of magnetic regenerators and a thermal fluid supply apparatus allowing thermal fluid to exchange with the plurality of magnetic regenerators, and the thermal fluid supplying apparatus is configured to operate by the rotation module without an additional configuration, which enables the magnetic cooling apparatus to have a similar configuration.

Magnetic cooling apparatus and magnetic refrigerating system having the same

Disclosed herein is a refrigerator having an inner case, a storage compartment formed in the inner case, an outer case provided outside the inner case, an inner frame coupled to an outer surface of the inner case to support the inner case, an outer frame coupled to an inner surface of the outer case to support the outer case, and a vacuum insulation panel provided between the inner case and the outer case to insulate the storage compartment and supported by the inner frame and the outer frame. The refrigerator can be assembled without foaming insulation and maintain rigidity.

Refrigerator and vacuum insulation panel thereof

Growing community of inventors

Yongin-si, South Korea

Keon Kuk