Matsushita Electric Industrial Co., Ltd.

Kenzou Hatada

Toshio Yamada

Shin Hashimoto

Isao Miyanaga

Atsushi Fujiwara

Yasushi Okuda

Yoshirou Nakata

Yukiharu Uraoka

Hiroaki Fujimoto

Yoshinobu Takeshita

Kazuya Otani

Koji Hidaka

Tsuguo Sakiyama

A retainer board, holding a semiconductor wafer having a plurality of integrated circuit terminals for testing a semiconductor chip, is provided in confronting relation to a probe sheet having a plurality of probe terminals electrically connected to their corresponding integrated circuit terminals. An insulating substrate, having wiring electrically connected to the plural probe terminals, is provided on the probe sheet in opposed relation to the retainer board. An elastic member is interposed between the probe sheet and the insulating substrate. The retainer board and the probe sheet are brought into so closer relationship that each integrated circuit terminal of the semiconductor wafer held by the retainer board is electrically connected to its corresponding probe terminal of the probe sheet.

Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Semiconductor wafer package, method and apparatus for connecting testing

A method for fabricating semiconductor devices comprising pressing first and second semiconductor devices against a transparent board at different times by means of first and second pressure tools that are separate from each other and move upward and downward independent of each other so that a difference in thickness between the devices and a deflection of the devices can be absorbed and a reliable electrical connection between the electrodes of the devices and the conductors of the board can be attained, which makes it possible to continuously achieve a highly dense assembly of semiconductor devices with a minute gap therebetween.

Method for attaching semiconductors to a transparent substrate using a

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Osaka, Japan

Kenzou Hatada