Senju Metal Industry Co., Ltd.

Kenzo Tadokoro

Ryoichi Kurata

Minoru Toyoda

Hideaki Tanibata

Kimihiko Kurosaki

Shunsaku Yoshikawa

Tsukasa Ohnishi

Yoshitsugu Sakamoto

Issaku Sato

Yoshie Yamanaka

Hiroyuki Yamada

Kazushige Kumagai

A sliding member includes a metallic substrate, a porous layer formed on a surface of the metallic substrate, and a sliding layer that covers the porous layer. The porous layer is made of a metal itself or an alloy composition. The sliding layer is made of a lead-free resin composition. The resin composition contains an essential additive, optionally an optional additive, and a fluororesin. The essential additive is any one of a combination of a zinc compound and a carbon fiber, a combination of a zinc compound and an iron oxide, and a combination of a zinc compound, a carbon fiber and an iron oxide. A total content of the essential additive and the optional additive is 10 vol % or more and 35 vol % or less in the resin composition.

Sliding member and bearing

A sliding member includes a metallic substrate, a porous layer formed on a surface of the metallic substrate, and a sliding layer that covers the porous layer. The porous layer is made of a metal itself or an alloy composition. The sliding layer is made of a lead-free resin composition. The resin composition consists of a pitch-based carbon fiber and a fluororesin, and assuming weight of the resin composition as 100, more than 10 weight % and 35 weight % or less of the pitch-based carbon fiber is contained.

To provide a sliding member that improves seizure resistance by restraining any exposure of the porous layer and improves abrasion resistance and load resistance. The sliding memberconstitutes a bearing having a cylindrical shape, an inner circumferential surface of which is a sliding layerwith an axis. In the sliding member, a porous layermade of alloy material is formed on a surface of a metal baseand this porous layeris covered by resin materialso that the sliding layeris formed. In the sliding member, a particle size of metal powderforming the porous layeris within a range of 15 through 60 &#x3bc;m, preferably, about 25 through 45 &#x3bc;m. Further, in the sliding member, a thickness of the porous layeris within a range of 0.06 through 0.1 mm and a thickness of the sliding layeris within a range of 0.08 through 0.16 mm The thickness of the sliding layeris set to be thicker on average than the thickness of the porous layerso that the porous layeris not exposed.

A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.

Bonding material for semiconductor devices

To provide a sliding member which can control a relationship between dynamic friction force and static friction force, a sliding memberconstitutes a bearing having a cylindrical shape and its internal circumferential surface is a sliding layeralong a shaft. The sliding memberis provided a surface of the sliding layerwith uneven surface. The uneven surfacehas the line-like projections, vertexes of which are arranged in gridlike fashion, in the embodiment, to prevent an oil film from being formed and to make the dynamic friction force larger and keep the rate of change in the dynamic friction force in relation to the static friction force smaller. The sliding layer is configured so that a porous layer made of alloy material is formed on a surface of a metal substrate and the resin filled into the porous layer is sintered.

Sliding member

A multi-layer sliding part is prepared by a process including mixing 1&#x2013;50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5&#x2013;20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a metal backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate. After sintering of the pulverized powder to form bearing metal layer, the bearing metal layer is pressed and densified. After densification, the bearing metal layer is annealed, again pressed, and then coated with a resin having good sliding properties.

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Tokyo, Japan

Kenzo Tadokoro