The Furukawa Electric Co., Ltd.

Sony Chemicals Corporation

Harima Chemicals, Incorporated

Kenzo Kobayashi

Hirokazu Shiroishi

Hideto Tachibana

Masaaki Yamamoto

Toshiaki Amano

Takao Fukunaga

Takao Kobayashi

Tomoya Kato

Hajime Mochizuki

Hisao Irie

Yuichi Obara

Masanao Kono

Ryo Inoue

Hiroshi Yatabe

Yoshihiro Onuma

Hisao Nakajima

Jitsuo Migita

An optical sensor has an optical block including a substrate, a light-emitting element formed on the substrate, and a light-receiving element formed on the substrate by using an adjusting member for arranging side-by-side with the light-emitting element, a light-transmitting member located between the optical block and an object, and connecting terminal optically connected to the light-emitting element and the light-receiving element. It is preferable that the light-transmitting member is separated into a plurality of light transmitting members in correspondence with areas separated on the object. There is also provided an optical sensor having a light-transmitting member, a plurality of incident optical fibers, optically coupled with the light-transmitting member, for transmitting light emitted from a light-emitting element to the light-transmitting member, a plurality of outgoing optical fibers, optically coupled with the light-transmitting member, for transmitting light passed through the light-transmitting member after being reflected on an object to the light-receiving element, and a housing for integrally housing the light-transmitting member, the incident optical fiber, and the outgoing optical fibers.

Optical sensor with fiberless optical member

The composite circuit board comprises a substrate made of an insulating material, a thick circuit conductor, embedded in this substrate, which includes a given portion for connecting components to the thick circuit conductor and has a predetermined circuit pattern, a thin circuit conductor, provided on the surface of the substrate, which includes a land corresponding to the parts-mounting section of the thick circuit conductor and has a predetermined circuit pattern, and a conductor for electrically connecting the land and the given portion of the thick circuit conductor. In this circuit board, the land and the given portion of the thick circuit conductor are connected by a conducting member provided in the through hole.

Composite circuit board having means to suppress heat diffusion and

A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.

Solder precipitating composition

For electronic circuit members including a high density fine pattern electrode and a flexible printed circuit, a reinforced connecting part includes a reinforcing fastener which is a substantially cylindrical section shaped element having edges defining an axial slit clamping the circuit members. The reinforcing fastener is formed of an alloy having both superelastic and shape memory characteristics at a temperature above the Martensite transformation temperature of the alloy. The alloy is brought to a temperature above the Martensite transformation temperature after the slit is opened at a temperature below the Martensite temperature of the alloy and the electronic circuit members are attached via the slit. The circuit members can thus be fastened with a substantially constant force over time due to the superelastic and shape memory characteristics of the alloy.

Reinforced connection for a electronic circuit members and method for

A molded circuit board is constructed by forming a plurality of resin moldings integrally with a circuit film including an insulating film and circuit pattern on the insulating film, spaced specified distances therebetween, on one side of the circuit film. The plurality of moldings can be assembled into an electronic device box by bending the intermediate portion, between the moldings, of the circuit film.

Molded circuit board

A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.

An insulating sheet having through holes formed therein at positions where circuit patterns formed on its both surfaces are electrically connected is prepared. A sheet for forming a hole bottom is attached to one surface of the insulating sheet. Subsequently, a first-layer circuit pattern is printed on the other surface of the insulating sheet to which the hole-bottom sheet is not attached, and a conductive paste is filled into the holes. Thereafter, the hole-bottom sheet is removed. Then, a second-layer circuit pattern is printed on the surface of the insulating sheet, from which the hole-bottom sheet is removed. With this process, a two-layer printed circuit sheet is manufactured.

Method of manufacturing two-layer printed circuit sheet

A reinforcing fastener for fastening a chemical connector and an electronic circuit includes a substantially cylindrical section shaped element having edges defining an axial slit, wherein the element is formed of an alloy having both superelastic and shape memory properties. The slit is of such a size at a temperature below the Martensite transformation temperature of the alloy that the alloy is superelastically deformed when the slit is maintained at the same size while the alloy is above the Martensite transformation temperature. This results in the chemical connector being fastened to the electronic circuit with a substantially constant force over time.

Growing community of inventors

Ichihara, Japan

Kenzo Kobayashi