Matsushita Electric Works, Ltd.

Kenzi Ogasawara

Masahiro Matsumura

Tokio Yoshimitsu

Yoshihisa Sugawa

Atsuhiro Nakamoto

Yoshihide Sawa

Shingo Yoshioka

A polyimide composition is obtained by adding triallyl isocyanurates to polyimide, preferably with further addition of an accelerator and diluting solvent. The composition is made to show effective reduction in dielectric constant as well as in the inherent viscosity and surface tension so that, when employed in manufacturing laminates, the degree of impregnation into base material can be elevated to remarkably improve resin filling.

Polyimide composition and prepreg and laminate thereof

Superior polyimide prepolymers particularly suitable for fabrication of multi-layer printed boards are produced by reacting unsaturated bisimides with diamines to consist essentially of 41-55% of unreacted reactants, 39-54% of components having a molecular weight of between 400 and 15,000, and 3.0-6.8% of components having a molecular weight of more than 15,000. The resulting prepolymers enable the preparation of their solution having enough working life for successfully impregnating a given substrate therewith in the preparation of prepregs. The prepregs, prepared from the above prepolymers in such a way as to contain within the resin content thereof 29-35% of unreacted reactants, 51-65% of the components having a molecular weight of between 400 and 15,000, and 5-14% of the components having a molecular weight of more than 15,000, allow the fabrication of laminate products with remarkable dimension stability under a low molding pressure to eliminate the presence of voids in the products, in addition to that the prepregs ensure a high bond strength as well as elongated working life which is responsible for prevention of a blister in the finished laminate and for easy control of the laminate forming process.

Polyimide prepolymer composition from unsaturated bisimide and diamine

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Kadoma, Japan

Kenzi Ogasawara