Yamaha Corporation

Nippon Gakki Seizo Kabushiki Kaisha

Richstone Limited

Kenzaburou Iijima

Yoshinori Hayashi

Toshiharu Hoshi

Seiya Nishimura

Terumoto Nonaka

Kazuo Kurahashi

Takeo Sata

Satoru Tomaru

Akira Usui

Yoshikazu Ishii

Masayuki Takamura

Katsunori Suzuki

Atsushi Uchiyama

Takahiro Hayashi

Katsuhiko Masuda

BooSeok Hwang

Mutsumi Harada

Hidetoshi Yasutake

Katsufumi Kondo

Nanayuki Takeuchi

Hiroaki Itoh

Michio Miura

Iijima Toshiharu

Yasuyuki Chujo

Kouji Yataka

Toshihiro Muramatsu

Mitsuo Yamaguchi

Makoto Suzuki

Yuoshinori Hayashi

Katsuyuki Yokoi

A Peltier module is appropriate to a cooler incorporated in an optical communication module, and includes a series of Peltier junctions sandwiched between two substrates and power supply electrodes respectively connected to the outermost Peltier junctions, wherein the power supply electrodes pass through hollow spaces formed in one of the substrates so that conductive wires approach the contact areas in the upper surfaces of the power supply electrodes through the hollow space without a sharp bend.

Peltier module with durable power supply lines and exothermic module with built-in cooler

An optical fiber coupler reinforcing member comprises an approximately rectangular member formed by a hard material, and has a flat surface along the longitudinal direction thereof. In addition, the shape thereof in cross-section is a hexagonal shape which inscribes a cylindrical member. Furthermore, a recess having a U-shaped cross-section is formed in the longitudinal direction of the above-mentioned approximately rectangular member and houses coupling section. The coupling section housed within the recess is fixed at both ends of the recess by an adhesive or the like. In addition, both ends of the inner wall surface of the recess have been given bevel sections. As a result, the optical fiber coupler reinforcing member having high reliability at low cost, with which the strength with respect to external force is improved and with which processability and the assembly operations of the optical fiber coupler are easy, are provided.

Optical fiber coupler reinforcing member and optical fiber coupler

A heat radiator for dissipating heat from an electronic device, which is mounted on a board or which is installed in a casing, to the outside thereof is basically composed of a substrate having plenty of through holes, which are produced by press molding and sintering. The substrate having a low thermal expansion coefficient is made of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is smaller than the tungsten content or molybdenum content. The through holes each having a circular shape or a rectangular shape are infiltrated with the compound having a high thermal conductivity and composed of a copper-tungsten alloy or a copper-molybdenum alloy in which the copper content is greater than the tungsten content or molybdenum content. Thus, the heat radiator allows thermal conduction along axial directions of the through holes while substantially avoiding unwanted thermal expansion thereof.

Heat radiator for electronic device and method of making it

A semiconductor chip mounting method consisting of steps is performed to mount a semiconductor chip on a substrate. Herein, an electrode is formed on a main surface of the semiconductor chip and is covered with an insulating film. A contact hole is formed through the insulating film to be in contact with a part of the electrode. In addition, a Ni layer is formed to cover the contact hole. A wiring layer is formed on a main surface of the substrate and is covered with an insulating film. To achieve laser beam bonding effected between the semiconductor chip and substrate, a solder is provided for either the semiconductor chip or the substrate. For example, it is possible to provide a solder layer which is formed through a part of the insulating film to be in contact with the wiring layer of the substrate; or it is possible to provide a solder bump which projects from a concavity of the Ni layer of the semiconductor chip. Next, a laser beam is irradiated through the substrate, having laser beam permeability, and toward the solder. Thus, the semiconductor chip is bonded together with the substrate. Incidentally, a diameter in irradiation of the laser beam can be narrowed within a range between 1 .mu.m and 25 .mu.m, for example. This brings a reduction in a contact area between the semiconductor chip and substrate which are bonded together. Results of our studies show that a good electric connection can be provided between the electrode of the semiconductor chip and the wiring layer of the substrate under a limited condition where the Ni layer and the wiring layer both have a thickness which ranges between 0.6 .mu.m and 3 .mu.m, for example.

Semiconductor chip mounting method

The initial movement of a spherical body is detected by detecting the intersection with a light beam emitted from trigger light illuminating portion 2 to trigger light-receiving portion 3, and as a result, measurement of time by an arithmetic processing unit is started. During flight, spherical body 1 intersects light beams emitted from surface velocity sensors 4 and 5, the reflected light therein is detected by these surface velocity sensors 4 and 5, and the surface velocity of spherical body 1 is then measured. Spherical body 1 continues in flight and intersects at least two light beams irradiated from multi-beam illuminating portion 6 which are detected by multi-beam light-receiving portion 7. Based on a signal from multi-beam light-receiving portion 7 the arithmetic processing unit measures the time of intersection of spherical body 1 with a light beam, and then calculates the angle of elevation, horizontal angle, velocity and surface velocity of spherical body 1 based on the aforementioned measured time period. Furthermore, this arithmetic processing unit also calculates the amount of directional rotation of spherical body 1 based on the aforementioned calculated angle of elevation, horizontal angle, velocity and surface velocity of spherical body 1.

Flying spherical body measuring apparatus

A speaker diaphragm has a laminated construction in which a core layer is made of a porous diamond type wafer or wafers and sandwiched by a pair of surface layers made of diamond type material. Presence of numerous small pores in the core layer reduces the specific gravity of the entire diaphragm, thereby increasing efficiency in acoustic conversion. The porous construction of the core layer reduces internal loss of the diaphragm, and suppresses resonance in the treble range.

Speaker diaphragm

This invention concerns a new type of golf club head bodies produced by electrolytic deposition of metals, alloys and electrolytic codeposition of metal-matrix composite materials. The golf club heads so produced are comparatively free from structural defects, thus enabling production of high performance golf clubs having thin-walled heads to provide both lightness and strength.

Golf club head and its manufacturing

A sintered elongated core made of a ceramic type superconductive material consisting essentially of (R.sub.x Ba.sub.(1-x)).sub.3 Cu.sub.2 O.sub.z in which R is Sc, Y La, Ho, Dy or Eu; x is in the range of from 0.3 to 0.8; and z is in the range of from 6 yo 7, is encased in glass and then heated, stretched and drawn.

Method of drawing glass encased superconductive oxide core

An absolute encoder for detecting the absolute (as opposed to the relative) rotational displacement of an encoder shaft includes a pair of pitch signals recorded on tracks and an associated signal processing circuit. The pair of pitch signals have different periods (wave lengths) which are such that they have no common factors. The signal processing circuit includes magnetic sensors for producing absolute position data indicative of the degree of displacement of the encoder shaft, on the basis of the pitch signals. Through the use of a pair of pitch signals having periods with no common factor, a high degree of resolution is obtained, without having no significantly increase the number of pitch signal tracks.

Absolute encoder

A rotary encoder which serves to generate absolute position data is outfitted with a power source monitor which generates, during a power interruption, an alarm signal which invalidates all subsequent absolute position data being outputted by the rotary encoder. Loss of output data from the rotary encoder is reliably prevented, even upon the unexpected occurrence of very short power supply interruptions. This enhances the operational reliability and stability of the encoder considerably.

Power source monitor and a rotary encoder with such a monitor

In constructoin of a magnetic recording medium provided with one circular track for magnetic graduations and another circular track for standard marks, the standard marks are accompanied with specified magnetic identification marks so that discrimination between the standard marks can be fairly done without any influence by the number of the standard marks only by reading them out together with the identification marks. The medium is advantageously used for displacement detectors such as magnetic rotary encoders and magnetic linear scales.

Magnetic recording medium for displacement detectors

In construction of a signal processing circuit for an encoder including a pair of phased magnetic sensors arranged, for relative displacement, facing a magnetized track on a scale, output signals issued by the magnetic sensors are first stage divided by an analog processing unit and, after conversion into digital signals, second stage conversion is carried out by a digital phase locked loop connected to the analog processing unit. The degree of dissolution in detection of the displacement by the entire circuit is remarkably enhanced by the dual stage division of the signals during processing.

Signal processing circuit for an encoder

In construction of a magnetic encoder used for detection of displacement of a mobile body, a circular magnetized pattern is formed on one longitudinal end face of a magnetic rotary spindle mechanically coupled to the mobile body, and a magnetic sensor faces the magnetized pattern with a prescribed gap. Direct formation of the magnetized pattern on the rotary spindle excludes production errors caused by the conventional coupling process and end-face magnetization assures significant compactness of the entire construction.

Compact magnetic encoder

A magnetic-resistor sensor is provided with two or more comb-like patterns of different pitches formed on a single base plate and each comb-like pattern is adapted for use in combination with a magnetic scale of a corresponding information pitch so that one magnetic-resistor sensor could span magnetic scales of different information pitches. Such a universal magnetic-resistor sensor is used for a magnetic encoder having a magnetic scale in which a magnetic information pattern and a reference position pattern are formed in the same single track, thereby conserving space on the magnetic scale.

Magnetic-resistor sensor and a magnetic encoder using such a sensor

An improved non-contact type pattern sensor includes a magnetic resistor element arranged facing a pattern track on a recoridng medium having a magnetized pattern in the pattern track. A clearance sensor is arranged to face the pattern track on the recording medium and generates a detection signal as a function of the distance between the clearance sensor and the pattern track. The control unit connected to the clearance sensor generates an output signal which varies as a function of the detection signal. A magnetic field generator connected to the control unit is arranged near the magnetic sensor element and generates a bias magnetic field whose intensity varies as a function of the output signal.

Growing community of inventors

Shizuoka, Japan

Kenzaburou Iijima