Dai Nippon Printing Co., Ltd.

Kenzaburo Kawai

Koichi Suzuki

Kazunori Oda

Yoshinori Murata

Megumi Oishi

Akira Sakamoto

Shinichi Kobayashi

Hiroto Yoshinuma

An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically conductive layer and an electrically insulating layer. The wiring pattern layers are attached to the substrate through an electrically insulating layer.

Multi-layer printed-wiring board process for producing

Growing community of inventors

Matsudo, Japan

Kenzaburo Kawai