Hitachi, Ltd.

Hitachi Microcomputer System, Ltd.

Hitachi Tohbu Semiconductor, Ltd.

Hitachi Tobu Semiconductor

Hitachi Communication Systems, Inc.

Kenya Yamauchi

Kouichi Yamazaki

Makoto Furihata

Setsuo Ogura

Kazuyuki Kamegaki

Yukinori Kitamura

Takashi Jin

Tuyoshi Nagase

Shinichi Ishihara

A first reproduced color under signal is delayed by one or two horizontal periods by a delay circuit, and this delayed second reproduced color under signal and the aforementioned first reproduced color under signal have their frequencies converted individually by first and second frequency converters into standard color signals. An oscillatory frequency signals of 2n of carriers for the aforementioned frequency conversions are divided to have the aforementioned carrier frequencies and to produce four carriers having phases of 0, 90, 180 and 270 degrees. These carriers are selectively fed to the first and second frequency converters by switches so that the two frequency-converted signals are subtracted or added in phase or in opposite phase to clear the noise (or crosstalk component), which is caused by the crosstalk between the tracks.

Signal processor for VTR which converts color under signals to color

When a semiconductor integrated circuit device having a wiring structure of three or more layers is hierarchically considered as a collection of a plurality of functional blocks, each functional block is internally connected by wirings in the first wiring layer, in which wirings have their main extended direction prescribed to be the X-direction, and wirings in the second wiring layer, in which wirings have their main extended direction prescribed to be the Y-direction, formed over the first wiring layer. Wirings in the third wiring layer, in which wirings have their main extended direction prescribed to be the same as the wirings in the second wiring layer, formed over the second wiring layer, together with wirings in the first and second wiring layer, are used as signal wirings between functional blocks, while the wirings in the third wiring layer are used as power supply wirings for providing power supply to functional blocks. As the power supply paths to functional blocks, a plurality of power supply wirings are branched off from the power supply electrode such as a power supply pad and terminated there. The power supply electrode on the high voltage side and the power supply electrode on the low voltage side are disposed separately at opposing edge portions of the semiconductor substrate and the power supply wirings proceeding therefrom to their target functional blocks are bent in the vicinity of the edge portion of the semiconductor substrate and therefrom extended straight to the target points.

Semiconductor integrated circuit device

Growing community of inventors

Takasaki, Japan

Kenya Yamauchi