Hitachi-high-technologies Corporation

Hitachi High-tech Electronics Engineering Co., Ltd.

Kenya Wada

Hideaki Kataho

Hiroshi Okada

Hisayoshi Ichikawa

Jun Onoshiro

Kouji Hiraseko

Kazuto Kinoshita

Ichiyo Ando

Kazuhiko Gommori

Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.

Method and apparatus for coating resin

An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mold is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.

Method and apparatus for pattern transfer, and annular recording medium

Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.

Method and apparatus for imprinting energy ray-setting resin, and discs and semiconductor devices with imprinted resin layer

An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold. A chuck mechanism is provided inside of the lower press member, the chuck mechanism having at least three chuck pawls located in uniformly spaced positions along inner periphery of the substrate plate. The chuck pawls are radially displaceable to take either an operative position or a receded position, and are adapted to grip the inner periphery of the substrate together the small-diameter segments of the center hole of the mold at the time of setting the substrate plate in alignment with the mold, and to grip the inner periphery of said substrate plate alone, at spaced positions from the large-diameter segments of the center hole of the mold, at the time of separating the substrate plate from said mold.

On an application stage of resin are provided two (2) sets of dispensersand. The one dispensersupplies the resin directing to an upper side corner on a liquid crystal cell, while the other dispenserdirecting to a lower side corner thereon. The dispenserhas a syringeand a needle-like nozzle, and the needle-like nozzleemits the resin, directing upward obliquely, onto the lower side corner. Thereby, the resin can be supplied between an edge portion of a lower substrate and a lower surface of a connecting board, but without turning over the panel for display, such as, a liquid crystal cell, etc.

Resin application method on panel, manufacturing method of panel for display and resin applying apparatus thereof

Resin application method on panel, and manufacturing method of panel for display

From a supply reel which is set in position at an ACF (Anisotropic Concuctive Film) feeding station, an ACF tape having an ACF laminated on one side of a liner tape is drawn out by an ACF bonding means. At least two reel mount members are provided on a reel stand at the ACF feeding station to mount two ACF tape supply reels concurrently thereon. The reel stand is connected to a switch means thereby to switch the two reel mount members either to an operating or tape supplying position or a standby position. As soon as an ACF tape from a supply reel in the operating position is consumed completely, a fresh supply reel in the standby position is switched into the operating position to continue the supply of the ACF tape.

ACF tape feeder machine, and method for feeding ACF tape

Carrier tapes, each carrying electronic circuitry parts at predetermined intervals on a carrier portion, are successively and continuously fed to a punching station from a tape feeding station with at least a pair of tape supply reels. While a carrier tape from a first supply reel is being fed to the punching station, a carrier tape from a second supply reel is set in a standby position. As soon as the carrier tape from the first supply reel is consumed to a last electronic part, a head end of the carrier tape from the second supply reel is spliced to a tail end of the carrier tape of the first supply reel by means of tape holder members located in the course of a tape supply route between the tape feeding station and the tape punching station, thereby make replacement of the tape supply reel quicker and easier.

Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape

Method and apparatus for treating a surface of a substrate plate under irradiation of ultraviolet ray emitted from a dielectric barrier discharge lamp. Upon admission into a treating chamber, oxygen is removed from a treating surface and surrounding atmosphere of a substrate plate in order to suppress energy losses of ultraviolet ray to a minimum.

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Tokyo, Japan

Kenya Wada