Sony Semiconductor Solutions Corporation

Kenya Nishio

Suguru Saito

Nobutoshi Fujii

Hirotaka Yoshioka

Provided is an imaging unit more efficiently manufacturable with high dimensional precision. The imaging unit includes: a sensor board including an imaging device, in which the imaging device has a plurality of pixels and allows generation of a pixel signal by receiving outside light in each of the plurality of pixels; a bonding layer including an inorganic insulating material; and a circuit board including a circuit chip and an organic insulating layer, in which a circuit chip has a signal processing circuit that performs signal processing for the pixel signal and is bonded to the sensor board through the bonding layer, and the organic insulating layer covers a vicinity of the circuit chip.

Imaging unit, method for manufacturing the same, and electronic apparatus

An imaging device according to an embodiment of the present disclosure includes: a first semiconductor substrate () provided with pixels including a photoelectric conversion element (PD) and floating diffusion (FD) that temporarily holds a charge output from the photoelectric conversion element (PD); and a semiconductor layer (Y) provided on the first semiconductor substrate () via an insulating film (), the semiconductor layer (Y) including a readout circuit unit () that reads out the charge held in the floating diffusion (FD) and outputs a pixel signal, in which the semiconductor layer (Y) is formed of an organic semiconductor material.

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Kanagawa, Japan

Kenya Nishio