Ebara Corporation

Chisso Corporation

Jnc Corporation

Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Fujimi Incorporated

Nihon Micro Coating Co., Ltd.

Is Engineering Co., Ltd.

Kenya Ito

Masaya Seki

Yu Ishii

Masayuki Nakanishi

Mikio Yamahiro

Tetsuji Togawa

Nobumasa Ootake

Hisao Oikawa

Tamami Takahashi

Mitsuhiko Shirakashi

Koji Ohguma

Kenji Yamaguchi

Masami Tanaka

Hiroyuki Kawasaki

Hiroshi Tomita

Naoki Matsuda

Keisuke Uchiyama

Yasuhiro Yamamoto

Yoshinobu Tsujii

Takeshi Fukuda

Takeo Kubota

Kohji Ohno

Kenichi Watanabe

Kazuhiro Yoshida

Takayuki Saito

Atsushi Shigeta

Soichi Nadahara

Takeshi Nishioka

Hiroaki Kusa

Kenji Iwade

Kaoru Yamada

Hiroyuki Iizuka

Kenichi Nagaoka

Hirohiko Ueda

Norio Kimura

Yuki Inoue

Masako Kodera

Akihisa Hongo

Hideo Aizawa

Motoyuki Sato

Tsukuru Suzuki

Gen Toyota

Michiyoshi Yamashita

Aki Kuromatsu

Kazuyuki Inoue

Masayuki Kamezawa

Nobuyuki Ootsuka

Kenichi Kobayashi

Hiroyuki Yano

Jun Watanabe

Jun Tamura

Junji Kunisawa

Takehiko Hamaguchi

Hiroyuki Sato

Akira Fukunaga

Kunihiko Sakurai

Makoto Kashiwagi

Dai Fukushima

Hiromi Yajima

Takashi Katoh

Yoshikuni Tateyama

Hiroo Suzuki

Mitsuo Tada

Satoshi Wakabayashi

Hitoshi Morinaga

Kazusei Tamai

Kunio Oishi

Minoru Nakayama

Kenji Kodera

Fumitoshi Oikawa

Yoshitaka Morimoto

Kenichi Shigeta

Yasuhiro Shiraishi

Hiroshi Asano

Yasunari Suto

Ichiro Katakabe

Yuji Makita

Satoru Sato

Takahiro Nanjo

Takayuki Hattori

Koji Ato

Takuro Tanaka

Yuka Takahashi

Kyoko Kondo

Akiko Yoda

Shozo Takahashi

Keizo Iwatani

Shino Sato

Kenji Kato

Souichi Asakawa

Shin Koga

Daisaku Fukuoka

Sumio Yabe

Hideshi Satake

Hirofumi Ichihara

Hisaoi Oikawa

Yuuki Inoue

Shingo Ohtsuki

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad () having an annular polishing surface () which has a curved vertical cross-section; a workpiece holder () for holding a workpiece (W) having a polygonal shape; a rotating device () configured to rotate the workpiece holder () about an axis of the workpiece (W); a pressing device () configured to press a periphery of the workpiece (W) against the annular polishing surface (); and an operation controller () configured to change a speed at which the rotating device () rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device () is disposed more inwardly than the workpiece holder () in a radial direction of the polishing table ().

Chemical mechanical polishing apparatus for polishing workpiece

To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.

Treatment device, plating apparatus including the same, conveying device, and treatment method

A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Substrate processing apparatus and substrate processing method

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

Method and apparatus for polishing a substrate, and method for processing a substrate

A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

Polishing method, polishing apparatus, and substrate processing system

A laminated film appropriate as a PPF material which has a three-layer structure in which a top coating layer including a urethane acrylate cured product, a substrate layer including polycarbonate thermoplastic polyurethane, and an adhesive layer including a pressure sensitive adhesive are in contact in that order. Preferably, the top coating layer includes a unit derived from &#x3b3;-methacryloxypropylhepta(trifluoropropyl)-T8-silsesquioxane.

Laminated film

Provided is a coating agent that can be formed into a surface layer having excellent self-restoring properties and stain-proof properties by applying the coating agent onto a surface of a base material (for example, thermoplastic polyurethane) and curing the resulting material. The coating agent according to the present application contains urethane (meth)acrylate-based resin (a), fluorine-based compound (b) and photopolymerization initiator (d). Urethane (meth)acrylate-based resin (a) has weight average molecular weight (Mw) of 10,000 to 800,000. Fluorine-based compound (b) has at least two polymerizable functional groups. The surface layer formed of the coating agent has excellent self-restoring properties of a scratch, stain-proof properties and stretchability.

Coating agent, coating film, laminate and surface-protected article

The transfer film for in-mold molding of the invention has transfer layerbeing a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L. Transfer layerhas topcoat layer Llaminated on base Lto be arranged on a surface of a molded product after in-mold molding; and conductor layer Llaminated on a side opposite to a base Lside of topcoat layer L, and laminated on topcoat layer L. Topcoat layer Lis composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer Lis formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer.

Transfer film for in-mold molding, method for producing in-mold molded product, and molded product

A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.

Substrate processing method and substrate processing apparatus

Pad holder for polishing apparatus

A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.

Polishing apparatus and polishing method

A projecting/receiving unit () projects a laser light to a peripheral portion () and receives the reflected light while a liquid is being fed to a substrate () and is flowing on the peripheral portion (). A signal processing controller () processes the electric signal of the reflected light to decide the state of the peripheral portion (). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion () may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.

Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus

A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

Abrasive film fabrication method and abrasive film

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Tokyo, Japan

Kenya Ito