Dai Nippon Printing Co., Ltd.

Nitto-denko Corporation

Kentarou Seki

Chikao Ikenaga

Chiaki Hatsuta

Kazuhito Hosokawa

Takuji Okeyui

Kazuhiro Ikemura

Keisuke Yoshikawa

Yo Shimazaki

Hiroki Furushou

Masahiro Yamada

Masahiro Nagata

Kazuhiro Shinozaki

Daisuke Okuyama

Hideto Matsui

Kazunori Oouchi

Kazunori Douchi

A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.

Lead frame and manufacturing method thereof

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y&#x2265;950 and y&#x2265;23x&#x2212;1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa).

Deposition mask, method of manufacturing deposition mask and metal plate

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y&#x2265;950 and y&#x2265;23x&#x2212;1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y&#x2265;950 and y&#x2265;23x&#x2212;1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

A semiconductor device includes a die pad, a semiconductor element which is loaded on the die pad, and a sealing resin. A plurality of electrically conductive portions each having a layered structure including a metal foil comprising copper or a copper alloy, and electrically conductive portion plating layers provided at both upper and lower ends of the metal foil are arranged around the die pad. The die pad has a lower die pad plating layer, and the semiconductor element is loaded on the die pad comprising such a die pad plating layer. Electrodes provided on the semiconductor element are electrically connected with top ends of the electrically conductive portions via wires, respectively. The lower electrically conductive portion plating layers of the electrically conductive portions and the die pad plating layer of the die pad are exposed outside from the sealing resin on their back faces.

Semiconductor device, substrate for producing semiconductor device and method of producing them

A semiconductor device P includes a die pad, a semiconductor elementwhich is loaded on the die pad, and a sealing resin. A plurality of electrically conductive portionseach having a layered structure including a metal foilcomprising copper or a copper alloy, and electrically conductive portion plating layersprovided at both upper and lower ends of the metal foilare arranged around the die pad. The die padhas a lower die pad plating layer, and the semiconductor elementis loaded on the die padcomprising such a die pad plating layer. Electrodesprovided on the semiconductor elementare electrically connected with top ends of the electrically conductive portionsvia wires, respectively. The lower electrically conductive portion plating layersof the electrically conductive portionsand the die pad plating layerof the die padare exposed outside from the sealing resinon their back faces.

A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheethaving a base layerand an adhesive layer, and a plurality of independently provided electrically conductive portions. A semiconductor element having electrodesformed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portionsand the electrodesof the semiconductor elementare electrically connected by using wires. The semiconductor element, wiresand electrically conductive portionsare sealed by using a sealing resin. Each of the electrically conductive portionshas overhanging portions, and a side faceof the electrically conductive portionis roughened, thus enhancing the joining strength between each electrically conductive portionand the sealing resin

Growing community of inventors

Tokyo, Japan

Kentarou Seki