Murata Manufacturing Co., Ltd.

Kentarou Kawabe

Toru Kurisu

Yushi Soeta

Kouki Shimizu

Akihiro Yamakawa

A maximum width of a second connection portion in a line width direction is smaller than a maximum width of a first connection portion in the line width direction. A first intermediate portion includes a first thick-line portion of which the width is greater than that of a transmission line portion in the line width direction. A second intermediate portion includes a second thick-line portion of which the width is greater than that of a transmission line portion in the line width direction. The first thick-line portion and the second thick-line portion adjoin the transmission line portion.

Multilayer substrate

A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second conductive layer is on a same insulating layer that the first conductive layer is on. The second conductive layer is on a same main surface as the top main surface or the bottom main surface of the insulating layer on which the first conductive layer is located. A second signal having a higher frequency than the first signal is transmitted through the second conductive layer. A top conductive layer is above the second conductive layer. A thickness of the second conductive layer in the up-down direction is smaller than that of the first conductive layer in the up-down direction.

Multilayer substrate and manufacturing method therefor

A circuit board includes a multilayer body including a main surface, a mounted conductor, and a signal conductor at an intermediate position in the lamination direction of the multilayer body, and a ground conductor on the main surface. The multilayer body includes a connection portion including a portion overlapping the mounted conductor and overlapping an external board joined via a conductive joint material through use of the mounted conductor, and a circuit portion. A first region, which is the region of a circuit portion of the ground conductor, includes opening holes and a second region, which is the region of a connection portion of the ground conductor, includes opening holes. The ratio of the opening area of the opening holes to that of the second region is larger than the ratio of the opening area of the opening holes to that of the first region.

Growing community of inventors

Nagaokakyo, Japan

Kentarou Kawabe