Canon Medical Systems Corporation

Kabushiki Kaisha Toshiba

Toshiba Medical Systems Corporation

Kentaro Tsuzuki

Yoichi Ogasawara

Takashi Kubota

Yasuhisa Makita

Yutaka Oonuki

An ultrasonic probe of an embodiment includes a head part. The head part includes a plurality of ultrasonic elements that output ultrasonic waves and receive reflected waves of the output ultrasonic waves. The head part is provided with a through hole for guiding a puncture needle and a slit for guiding the puncture needle to the through hole.

Ultrasonic probe and puncture adapter for ultrasonic probe

In one embodiment, a probe adapter includes: a holder configured to be detachably attached to an ultrasonic probe; a marker configured to be disposed at a predetermined position in an array direction of the ultrasonic probe and mark a surface of an object which the ultrasonic probe is brought into contact with, under a state where the holder is attached to the ultrasonic probe; and a wiper configured to remove an ultrasonic medium coated on the surface of an object.

Probe adapter, ultrasonic probe, and ultrasonic diagnostic apparatus

The purpose is to provide an ultrasound transducer and ultrasound probe without the complexity of the manufacturing process of the non-conductive acoustic matching layer while ensuring the electric conductive path. Pluralities of two-dimensionally arranged piezoelectrics are comprised in the ultrasound transducer. Electrodes are provided for each piezoelectric. Furthermore, the non-conductive acoustic matching layer with the first surface on the electrode side and the second surface on the opposite side of the first surface is comprised in the ultrasound transducer, and moreover, the electric conductive acoustic matching layer arranged on the second surface side of the non-conductive acoustic matching layer is comprised in the ultrasound transducer. Moreover, the substrate arranged on the opposite side of the non-conductive acoustic matching layer is arranged with respect to the electric conductive acoustic matching layer. The plurality of grooves penetrating the non-conductive acoustic matching layer, leading up to mid-way of the piezoelectrics of the first surface side or mid-way of the electric conductive acoustic matching layer of the second surface side is formed between the first surface and the second surface of the non-conductive acoustic matching layer. Moreover, the electrode and the substrate are electrically conducted via the groove.

Growing community of inventors

Nasushiobara, Japan

Kentaro Tsuzuki