Canon Kabushiki Kaisha

Fujitsu Corporation

Valeo Japan Co., Ltd.

Kentaro Suzuki

Shunsuke Nakatsuka

Hiroaki Sano

Sho Suzuki

Tetsuo Takahashi

Takayuki Ito

Yasuhiro Sekine

Yojiro Matsuda

Masatsugu Itahashi

Toshihiko Hosotsubo

Mari Isobe

Nobushige Korenaga

Junji Iwata

Takehito Okabe

Koji Ishizuya

Takayuki Endo

Tomokazu Sugiyama

Takashi Okagawa

Toshihiro Shoyama

Yukio Kazahaya

Satoshi Iwatani

Kazuhisa Gonda

Masahiko Sone

Akinori Makaino

Masanori Amemori

Yoshiaki Taguchi

Takeshi Konishi

Changheon Ohk

A light emitting device includes a plurality of first electrodes, an organic layer located above the plurality of first electrodes and including a light emitting layer, a second electrode located above the organic layer, and an insulating layer that separates the plurality of first electrodes from each other. An upper surface of each of the plurality of first electrodes includes an inner region in contact with the organic layer, and an outer region in contact with the insulating layer. The insulating layer includes an opening that defines the inner region, and a step located at a position away from the opening and overlapping the outer region.

Light emitting device, manufacturing method thereof, display device, photoelectric conversion device, electronic apparatus, illumination device, and moving body

A light-emitting device according to the present invention includes, on a substrate, an element area in which a light-emitting element is disposed, and a terminal area in which a terminal portion electrically connected to the light-emitting element is disposed, wherein the light-emitting element has, sequentially from the substrate, a reflective layer, a first insulating layer, a first electrode, a second insulating layer, an organic layer that includes a light-emitting layer, a second electrode, and a third insulating layer, the terminal portion has a pad electrode of a material identical to that of the reflective layer, the pad electrode has an exposed portion at which a surface on a far side from the substrate is exposed, and the third insulating layer extends from the element area up to an edge of the exposed portion in the terminal area.

Light-emitting device, display device, imaging device, and electronic device

An apparatus including sub-pixels arranged on a substrate, the sub-pixels including a first, a second, and a third sub-pixels, each of the sub-pixels including a lower electrode, an insulating layer covering an end portion of the lower electrode, an organic layer, and an upper electrode in mentioned order starting from a side closer to the substrate, at least part of the organic layer being continuously arranged in at least two of regions between a position on a first lower electrode included in the first sub-pixel and a position on a second lower electrode included in the second sub-pixel, between the position on the second lower electrode and a position on a third lower electrode included in the third sub-pixel, and between the position on the third lower electrode and the position on the first lower electrode.

Apparatus, display apparatus, photoelectric conversion apparatus, electronic equipment, illumination apparatus, and moving object

An image pickup device having a pixel region in which pixels are arranged, and in which a multilayer wiring structure is disposed. Each pixel includes a photoelectric conversion unit, a charge accumulation unit, a floating diffusion, a light shielding portion covering the charge accumulation unit and opening above the photoelectric conversion unit, and a waveguide which overlaps at least partially a portion at which the light shielding portion opens in a plan view. The device includes an insulating film disposed below the optical waveguide. The insulating film has a refractive index higher than that of an interlayer insulating film. The insulating film is disposed closer to the photoelectric conversion unit than to the lowermost wiring layer among wiring layers of the multilayer wiring structure. The insulating film extends to a portion above the light shielding portion. The insulating film is wider than a lower portion of the optical waveguide.

Image pickup device and method for manufacturing image pickup device

A variable capacity compressor includes a compression chamber that compresses a working fluid, an inlet chamber to house the working fluid to be compressed, a discharge chamber to house the working fluid compressed in the compression chamber and discharged therefrom, a control pressure chamber to house a swash plate rotating in accordance with a rotation of the drive shaft, a supply passage to facilitate communication between the discharge chamber and the control pressure chamber, a bleed passage to facilitate communication between the control pressure chamber and the inlet chamber, a first control valve including a first valve portion to adjust an opening degree of the supply passage, a second control valve provided on the bleed passage and including a spool housing recess formed on the bleed passage, and a back pressure chamber between the spool and a bottom of the spool housing recess.

Variable capacity compressor

A solid-state imaging device includes a light-shielding layer that is disposed in a pixel region containing a pixel including a photoelectric conversion element and a charge holding portion and a peripheral region in which a signal from the pixel is processed and that is electrically connected to a substrate at a contact portion in the peripheral region, a first insulating layer that has an end portion between the charge holding portion and the contact portion in plan view and that is disposed between the substrate and the light-shielding layer, and a first insulating member that is disposed on a side surface of the end portion of the first insulating layer and that buffers a step due to the end portion. A portion of the light-shielding layer overlapping the first insulating member in the plan view has an upper surface having a shape following a shape of the first insulating member.

Solid-state imaging device, imaging system, and method for manufacturing solid-state imaging device

A method for manufacturing a solid-state image pickup apparatus includes forming a first insulating film over a substrate after forming a gate electrode of a first transfer transistor and a gate electrode of a second transfer transistor, forming a second insulating film on the first insulating film, forming a first structure and a second structure on side surfaces of the gate electrodes of the first and second transfer transistors, respectively, via the first insulating film by etching the second insulating film in such a manner that the first insulating film remains on a semiconductor region of a photoelectric conversion unit and a semiconductor region of a charge holding unit, and forming a light shielding film that covers the gate electrode of the first transfer transistor, the semiconductor region of the charge holding unit, and the gate electrode of the second transfer transistor.

Method for manufacturing solid-state image pickup apparatus, solid-state image pickup apparatus, and image pickup system including the same

An apparatus for moving movable part on surface parallel to first and second directions includes single guide to constrain position of the movable part in the second direction and drive mechanism to drive the movable part. The movable part includes first movable member movable in the first direction while being guided by the guide, second movable member having first and second ends, the first end being connected to the first movable member via rotation bearing and moving above the surface, and third movable member movable within range between the first and second ends while being guided by the second movable member. The drive mechanism includes first driver to drive the first end of the second movable member in the first direction, and second driver to drive the second end of the second movable member in the first direction.

Positioning apparatus, lithography apparatus, and method of manufacturing article

A determination is made on whether or not an instruction of temporarily stopping a recommendation list is issued, and in a case where it is determined that the instruction for the temporary stopping is issued, even when another item is selected by a user, a control is conducted to avoid an update of the displayed recommendation list.

Information processing apparatus, information processing method, and storage medium

A document management system includes a document operation log recording unit configured to record as an operation log a history of operations for each document managed by the document management system, a print log collecting unit configured to collect a print log indicating a history of printing executed by a printing device, a log comparison unit configured to compare the operation log recorded by the document operation log recording unit with the print log collected by the print log collecting unit, a document printing determination unit configured to determine, based on a result of comparison by the log comparison unit, whether each document managed by the document management system was printed, and a document print information updating unit configured to update, based on a result of determination by the document printing determination unit, print information of each document managed by the document management system.

Document management system and document management method for determining whether at least one managed document was printed and updating print information of the at least one managed document based on the determination

An interlayer insulating film is disposed above an image pickup region and a peripheral region of the semiconductor substrate. An opening is formed in the interlayer insulating film at a position overlying a photoelectric conversion portion. A waveguide member is formed above the image pickup region and the peripheral region of the semiconductor substrate. A part of the waveguide member, which part is disposed above the peripheral region, is removed such that the interlayer insulating film is exposed.

Semiconductor device manufacturing method for forming an opening to provide a plug

A filmed head slider, which is capable of writing data with high density, can be made by uniformly machining film layers formed on a wafer for making the filmed head sliders. The method of machining the wafer comprises the steps of: measuring curvature of the filmed surface of the wafer; selecting a machining plate having a machining face, whose curvature is in accord with that of the filmed surface of the wafer, on the basis of the result of the measuring step; and machining the filmed surface of the wafer with the selected ma chining plate.

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Kawasaki, Japan

Kentaro Suzuki