Toray Industries, Inc.

Kentaro Sano

Noriyuki Hirano

Naokichi Imai

Junko Kawasaki

Reo Takaiwa

Keisuke Inose

Koji Furukawa

Atsuki Tsuchiya

Taiki Kuroda

Masato Honma

Toshiya Kamae

Sadayuki Kobayashi

Yuki Mitsutsuji

Nobuhiro Morioka

Keiichiro Nomura

Ayumi Mori

Soichi Yoshizaki

Hiroyuki Uchida

An epoxy resin composition includes: [A] an epoxy resin, [B] an aromatic diamine and [C] one or more compounds having a boiling point of 130° C. or more, a molecular weight of 50 to 250, no epoxy group and substantially no ability to cure epoxy resin. The following conditions are satisfied: (1) a component [C] compound has polar and hydrogen bond components that when summed in terms of the Hansen solubility parameter equals 10.0 or more; (2) a component [C] compound has a Hansen solubility parameter distance L to component [A] of 20.0 or less; (3) the ratio H/E between moles E of epoxy groups of component [A] and moles C of a component [C] compound satisfying both conditions (1) and (2) is 0.01 to 0.20; and (4) the viscosity of the composition when held at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

Epoxy resin composition, prepreg, and fiber reinforced composite material

An epoxy resin composition includes components [A] to [C]: [A] epoxy resin, [B] polyamine curing agent, and [C] a compound having a boiling point of 130° C. or more, a molecular weight of 50 to 250, no epoxy group in the molecule and substantially no ability to cure an epoxy resin. The composition satisfies conditions (1) and (2):

An epoxy resin composition includes the following components: [A] epoxy resin, [B] aromatic diamine, and [C] a compound having a boiling point of 130° C. or more, a molecular weight m of 50 to 250 no epoxy group in the molecule and substantially no ability to cure an epoxy resin. The composition also satisfies the following conditions: (1) the ratio H/E between moles E of epoxy groups in [A] and moles H of active hydrogen in [B] is 0.50 to 1.30; (2) at least a part of component [C] satisfies a ratio m/M in a range of 0.10 to 0.60 of the molecular weight m thereof to a theoretical molecular weight between crosslinking points, M, of a cured product of the epoxy resin composition; (3) the ratio C/E of moles E of epoxy groups of [A] to moles C of [C] satisfying condition (2) is 0.01 to 0.20.

A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130&#xb0; C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

Prepreg and fiber-reinforced composite material

Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii):

Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.

Epoxy resin composition, prepreg, and fiber-reinforced composite material

The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets certain conditions (a) to (d).

There is provided a cured product of an epoxy resin composition, in which the compounding composition and the phase-separated structure of the epoxy resin composition are controlled so that the balance between rigidity and toughness of the cured product is superior compared with those of cured products of conventional epoxy resin compositions. A cured product of an epoxy resin composition, which has both superior rigidity and superior toughness compared with conventional materials can be produced by curing an epoxy resin composition comprising an epoxy resin, a polyrotaxane having graft-chain-modified cyclic molecules and a curing agent for the epoxy resin.

Epoxy resin composition, resin cured product, fiber-reinforced composite material, and prepreg

A molded article includes 10 to 40% by mass of reinforcing fibers (A); and 60 to 90% by mass of a matrix resin (B) mainly including a polyarylene sulfide, the molded article satisfying conditions (I) to (IV) and having a tensile strength of 240 MPa or more in a main orientation direction of the reinforcing fibers (A) in the molded article:

Molded article and molding material

An epoxy resin composition includes [A] an epoxy resin, [B] dicyandiamide, [C] an aromatic urea and [D] a boric acid ester and satisfies any one of (i) requirements [a] and [b], (ii) requirements [c] and [d] and (iii) requirements [c] and [e]:[a]: the time from when the temperature reaches 100&#xb0; C. till when the heat flow reaches a peak top is 60 minutes or shorter as determined by a differential scanning calorimetry; [b]: the time from when the temperature reaches 60&#xb0; C. till when the heat flow reaches a peak top is 25 hours or longer as determined by a differential scanning calorimetry; [c]: the average in all of the epoxy resins is 165 to 265 g/eq inclusive; [d]: in the component [A], [A1] a resin represented by formula (I) and/or a resin represented by formula (II) is contained in an amount of 10 to 50 parts by mass relative to the total amount of all of the epoxy resins; and [e]: in the component [A], [A2] a glycidylamine-type resin having a functionality of 3 or higher is contained in an amount of 10 to 50 parts by mass relative to the total amount of all of the epoxy resins.

An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.

Epoxy resin composition, prepreg, and fiber reinforced material

A fiber-reinforced resin composition includes a polyarylene sulfide (A), a carbodiimide compound (B) and carbon fibers (C) in specific blending amounts and in which the carbon fibers (C) are surface-treated with a sizing agent (D), the carbodiimide compound (B) is an aliphatic carbodiimide compound, and the sizing agent (D) is a compound having three or more specific functional groups in one molecule; and a fiber-reinforced composite material includes a thermoplastic resin (A'), an adhesive compound (B&#x2032;) and reinforcing fibers (C&#x2032;) and in which the adhesive compound (B&#x2032;) is a compound having two or more specific structures in one molecule, the thermoplastic resin (A&#x2032;) is a thermoplastic resin containing an element other than carbon in a repeating unit structure of a main chain, and an abundance ratio Rb of the adhesive compound (B&#x2032;) is 1.2 or more.

Fiber-reinforced resin composition, and fiber-reinforced composite material

Provided are: an epoxy resin composition for fiber-reinforced composite materials, which has a good balance between storage stability and fast curing properties at high levels; a prepreg; and an epoxy resin composition which exhibits excellent mechanical characteristics as a fiber-reinforced composite material. A resin composition which contains an epoxy resin, dicyandiamide, an imidazole compound and an acidic compound, while satisfying the following conditions (a)-(c):

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material

A molding material includes 5 to 50 parts by mass of reinforcing fibers (A) with a sizing agent (s) deposited thereon, 1 to 20 parts by mass of a component (B) containing a polycarbodiimide compound (B-1) that is liquid at 50&#xb0; C., and 30 to 94 parts by mass of a thermoplastic resin (C) containing an element other than carbon in the repeating unit structure of the main chain, based on 100 parts by mass of the total of the components (A) to (C), wherein the molding material is a composite in which a composite fiber bundle (D) with the component (A) impregnated with the component (B) is covered with the component (C).

Molding material, method of producing same, and master batch used in same

A carbon fiber-reinforced polyarylene sulfide has both dynamic characteristics and molding cycle characteristics and can be produced with high productivity by preparing a polycarbodiimide-modified polyarylene sulfide using a polyarylene sulfide and a polycarbodiimide as raw materials, then melting the resulting polycarbodiimide-modified polyarylene sulfide, and combining the polycarbodiimide-modified polyarylene sulfide with carbon fibers at a specific ratio to produce a composite.

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Ehime, Japan

Kentaro Sano