Nissan Chemical Industries Limited

Nissan Chemical Corporation

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Tokai University Educational System

Kentaro Ohmori

Takehiro Nagasawa

Yuki Endo

Takeo Moro

Herbert Wolter

Taku Kato

Hideo Suzuki

Sho Yoshida

Toshiaki Takeyama

Kenji Takase

Keisuke Shuto

Michael Popall

Tsubasa Kashino

Hideyuki Nawata

Ruth Houbertz-Krauss

Takayuki Tamura

Takaaki Ishigure

Sayoko Tadokoro

Tetsuo Sato

Sebastien Cochet

Osamu Mikami

Yuki Saito

Kazuki Yasuhara

Ruth Houbertz

An optical waveguide-forming material has a low propagation loss even in a long wavelength region and has a high refractive index at a wavelength of 1,550 nm. An optical waveguide-forming composition includes (a) 100 parts by mass of a reactive silsesquioxane compound that is a polycondensation product of an alkoxysilane compound A of the following Formula [1]:Ar&#x2014;Si(OR)&#x2003;&#x2003;[1]and an alkoxysilane compound B of the following Formula [2]:Ar&#x2014;Si(OR)&#x2003;&#x2003;[2]and (b) 10 to 500 parts by mass of a fluorene compound of the following Formula [3]:  An optical waveguide can be formed by using the composition.

Optical waveguide-forming composition which contains reactive silsesquioxane compound

A production method for an optical waveguide including: a first step of inserting a needle-like portion at a tip end of an ejection unit into uncured cladding; a second step of moving the needle-like portion in the uncured cladding while ejecting an uncured material from the needle-like portion to form an uncured core surrounded and covered with the uncured cladding; a third step of removing the needle-like portion from the uncured cladding; and a fourth step of curing the uncured cladding and core, wherein the uncured cladding is composed of a composition including a reactive silicone compound composed of a polycondensate of a diarylsilicic acid compound of Formula [1] and an alkoxy silicon compound of Formula [2]Ar&#x2014;Si(OR)R&#x2003;&#x2003;[2]and a di(meth)acrylate compound of Formula [3] and the uncured core is composed of a composition including a reactive silicone compound and an aromatic vinyl compound of Formula [4] 

Production method for GI optical waveguide

A polymerizable composition suitable for producing a molded article that can maintain a high refractive index and a low Abbe's number and can be restrained from dimensional changes due to a high-temperature thermal history has (a) 100 parts by mass of a specific reactive silsesquioxane compound, (b) 10 to 500 parts by mass of a specific fluorene compound and (c) 1 to 100 parts by mass of a specific aromatic vinyl compound. A cured product can be obtained by curing the polymerizable composition.

Polymerizable composition comprising reactive silsesquioxane compound and aromatic vinyl compound

A polymerizable composition that is suitable to produce a molded product that can suppress cracking and dimensional change caused by a high-temperature heat history with a high refractive index of a cured product maintained. A polymerizable composition including (a) 100 parts by mass of the specific reactive silsesquioxane compound, (b) 10 to 500 parts by mass of the specific fluorene compound, a cured product obtained by the polymerizable composition and a material for a high-refractive index resin lens including the polymerizable composition.

Polymerizable composition containing reactive silsesquioxane compound

A method for producing an optical waveguide composing an optical path conversion component having an extremely low signal loss, allowing a high surface packaging density and high speed operation, and allowing high productivity. A method for producing an optical waveguide that propagates light from a surface of a support to an oblique direction not vertical to the surface, the method for producing an optical waveguide comprising the steps of: (1) providing an anti-reflective coating on the support; (2) placing a photosensitive resin composition on the anti-reflective coating, and exposing the photosensitive resin composition to a light ray entering from a direction non-vertical to the surface of the support through a photomask for curing the composition; and (3) removing the unexposed photosensitive resin composition by development; and an optical waveguide obtained by the method.

Method for producing optical waveguide

An optical waveguide-forming composition: 100 parts by mass of a reactive silicone compound (a) composed of a polycondensate of a diarylsilicic acid compound A of Formula [1] Arand Arare a phenyl, naphthyl or a biphenyl group optionally substituted, and an alkoxy silicon compound B of Formula [2]Ar&#x2014;Si(OR)R&#x2003;&#x2003;[2].Aris a phenyl, naphthyl or biphenyl group having at least one group having a polymerizable double bond, Ris methyl or ethyl group, Ris methyl, ethyl, or vinylphenyl group, and a is 2 or 3, and 1 part by mass to 200 parts by mass of a di(meth)acrylate compound (b) of Formula [3]. Rand Rare a hydrogen atom or methyl group, Ris a hydrogen atom, methyl group, or ethyl group, Land Lare an alkylene group, and m and n are 0 or a positive integer, wherein m+n is 0 to 20.

Optical waveguide-forming composition

There is provided a curable resin composition that exhibits high adhesive properties to materials such as glass, copper, aluminum, PET, and PC, which have been regarded as poor adherends relative to photo-curable compositions, and high adhesive properties also between adherends different from each other. A curable resin composition including a polyene compound of Formula (1): (where n1, n2, and n3 are each independently an integer of 2 to 4; and Rto Rare each independently a hydrogen atom or a Calkyl group). The composition may further include a thiol compound or a photopolymerization initiator. The thiol compound may be a compound having two to six thiol groups in the molecule, or be an aliphatic thiol, or be produced by a reaction of an aliphatic mercapto carboxylic acid and a polyhydric alcohol. The polyhydric alcohol may be an aliphatic polyhydric alcohol or hydroxyalkyl isocyanurate.

Photo-curable resin composition

[Problem] To provide a polymerizable composition having an excellent transparency in near-infrared wavelength and excellent heat resistance, and a method for producing the same. [Means of Solving the Problem] A polymerizable composition includes: a reactive silicone compound obtained by polycondensing a diaryl silicic acid compound of Formula [1] below with a silane compound, selected under compounds of Formula [2] and Formula [2b] below in the presence of an acid or a base; and (b) a compound having at least one polymerizable group selected from the group consisting of alkenyl group and (meth)acryl group, wherein Arand Arare independently a phenyl group optionally substituted with a C-Calkyl group, and X is a group which can undergo a hydrolytic condensation reaction, and wherein Aris naphthyl or anthracyl substituted with at least one group having a polymerizable double bond, or wherein Aris phenyl substituted with at least one group having a polymerizable double bond other than vinyl, or is phenyl substituted with at least two groups having a polymerizable double bond. 

Polymerizable compositions, cured products obtained therewith, and use of these materials

A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): [where each of E, E, and Eis independently an organic group of Formula (2) or Formula (3); and each of R, R, and Ris independently an optionally branched alkylene group or oxyalkylene group: (where Ris a hydrogen atom or a methyl group)]; and an acid generator.

Long-chain alkylene-containing curable epoxy resin composition

Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300&#xb0; C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formula, Rand Rindependently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; Rand Rindependently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively Rand Ron adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; Rrepresents a divalent organic group; and n represents an integer of not less than 2.) 

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Funabashi, Japan

Kentaro Ohmori