Mitsubishi Gas Chemical Company, Inc.

Kentaro Nomizu

Hiroshi Takahashi

Masanobu Sogame

Yoshinori Mabuchi

Yoshihiro Kato

Hiroaki Kobayashi

Eisuke Shiga

Katsuya Tomizawa

Tomo Chiba

Daisuke Ueyama

Mitsuru Ohta

Kenj Arii

A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 &#x3bc;m; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board

The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 &#x3bc;m to 100 &#x3bc;m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board

A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

Prepreg, metal foil-clad laminate, and printed wiring board

A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

Resin composition, prepreg, metal foil-clad laminate and printed wiring board

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Tokyo, Japan

Kentaro Nomizu