Seiko Epson Corporation

Kentaro Murakami

Katsuhiro Okubo

Takahiro Kanegae

Haruhisa Uezawa

Hiroki Kobayashi

Shingo Tomimatsu

Hiroyuki Hagiwara

Hiroshige Owaki

Hiroaki Okui

Hiroyuki Kobayashi

Yuichi Urabe

Yasushi Yajima

Kazushige Hakeda

Toshinobu Yamazaki

Yoshinori Nakajima

Yoshiki Sugawara

Hisashi Sato

Toru Chino

Hiromichi Nakashima

Toshiaki Ishikawa

Tomoo Kinoshita

Takayuki Shimosaka

Shuji Funada

Akihiro Furuya

Isao Takimoto

Hidekazu Todoroki

A liquid ejecting head includes: a nozzle row configured by arranging nozzles ejecting a liquid in a first-direction in a second-direction orthogonal to the first-direction; a drive element; and stacked components defining a common liquid chamber communicating with the nozzle row, in which the stacked components include a filter partitioning the common liquid chamber into an upstream common liquid chamber and a downstream common liquid chamber, a first-case defining a first-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the filter, and a second-case defining a second-common-liquid-chamber-portion as a part of the upstream common liquid chamber and stacked on the first-case, the second-common liquid-chamber-portion is positioned in a direction opposite to the first-direction from the drive element, and a width of the second-common-liquid-chamber-portion in a third-direction orthogonal to the first-direction and the second-direction is longer than a width of the first-common-liquid-chamber-portion in the third-direction.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.

A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.

A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.

A liquid ejecting head includes: a nozzle; a flow path member in which a flow path communicating with the nozzle is formed and which has an inner wall surface defining the flow path and an outer wall surface that faces away from the flow path with respect to the inner wall surface; and a temperature sensor disposed on a part of the outer wall surface and configured to detect a temperature of the liquid in the flow path. The flow path includes a narrowed region having a narrow width in a second direction orthogonal to a first direction in a direction in which the flow path extends, and the temperature sensor is disposed on a portion of the outer wall surface that forms the narrowed region.

A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.

A liquid ejecting head including a nozzle configured to eject a liquid, a liquid flow path communicating with the nozzle, a communication chamber including a communication port configured to communicate with atmospheric air, a partitioning wall portion provided between the liquid flow path and the communication chamber, the partitioning wall portion including an opening portion that communicates the liquid flow path and the communication chamber to each other, and an elastic member closing the opening portion.

Liquid ejecting head, liquid ejecting apparatus, flow path structure, and method of manufacturing liquid ejecting head

A channel member includes a liquid emission port coupled to a liquid introduction section to emit liquid to the liquid introduction section, and a liquid feeding port that receives liquid from outside to feed the liquid to the liquid emission port. The liquid emission port and the liquid feeding port have the same opening direction.

Channel member, head unit, and head unit group

A liquid ejecting apparatus includes a liquid ejecting head provided with a nozzle and a cap that executes capping for forming a first space to which the nozzle is open, in a surrounding manner. The cap includes a capping member that is provided with a suction hole and an atmosphere communicating hole which is configured to allow an inside of the cap to communicate with an outside, a liquid absorber that is disposed inside the capping member, and a reception member that is disposed inside the capping member so as to form a second space between the liquid absorber and the reception member. The second space is positioned closer to a side of the liquid ejecting head than to the liquid absorber in a posture of capping, and the atmosphere communicating hole is open to the second space.

Liquid ejecting apparatus and cap

A method of manufacturing a liquid ejecting apparatus which includes a container holder on which a first liquid container and a second liquid container are detachably mounted, an nozzles for ejecting the liquid supplied from each of the liquid containers, and an adjuster that is disposed at a position covered by the first liquid container and not covered by the second liquid container, the method including: ejecting liquid by the nozzles in a state in which the second liquid container is mounted without the first liquid container being mounted; and adjusting the liquid ejecting apparatus by the adjuster based on an ejection result in the ejecting of the liquid.

Method of manufacturing liquid ejecting apparatus and liquid ejecting apparatus

Provided is a liquid ejecting head including: a first board on which a driving element for ejecting liquid is installed; a second board which is installed on the surface of the first board and covers the driving element; a wiring board that includes a first surface on which a wiring, where a driving signal is supplied to the driving element, is formed and a second surface that is at the opposite side to the first surface, and where the first surface of a first end section is joined to the surface of the first board; and a filling material which covers the wiring by being formed at least between the first surface and a wall surface of the second board, in which the height of the filling material with respect to the surface of the first board is high at the first surface side in comparison to the second surface side.

Growing community of inventors

Matsumoto, Japan

Kentaro Murakami