Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kentaro Kumazawa

Yoshihiro Tomura

Kazuhiro Nobori

Teppei Iwase

Yuichiro Yamada

Hidenobu Nishikawa

Takayuki Higuchi

Kojiro Nakamura

Koujiro Nakamura

Takashi Inoue

Hidehiro Yoshida

Masahiro Ono

Shuhei Nakatani

Kazumichi Shimizu

Shigeru Kondou

Futoshi Ohtsuka

Yousuke Toyofuku

Takao Nagumo

Makoto Imanishi

The ink jet device is provided with a plurality of ink jet heads including a plurality of nozzles disposed linearly with each other at intervals in a predetermined longitudinal direction and ejecting ink in different regions each other in the printing width direction; and a position adjusting mechanism performing rotating operation of changing the intervals in the printing width direction of the nozzles by rotating the plurality of ink jet heads around an axis perpendicular to the print surface of the print object, and performing a shifting operation of shifting at least one of the plurality of ink jet heads in the printing width direction.

Ink jet device

A high precision printing method taking into consideration the variance in the thickness of a printing target. An ink-jet printing method, including: (i) measuring a distance between a printing target and at least one nozzle; (ii) measuring a flying speed and a flying angle of an ink(a) discharged from the at least one nozzle; (iii) printing a test substrate with an ink to identify a location on which an ink(b) is spotted, and calculating a thickness-related displacement that is a displacement from the location on which the ink is spotted, based on a thickness difference between the printing target and the test substrate from results obtained in Step (i), and the flying speed and the flying angle of the ink(a) obtained in Step (ii); and (iv) discharging an ink(c) from the at least one nozzle to achieve actual printing of the printing target with the ink(c) while correcting the thickness-related displacement.

Ink jet printing method printing a test substrate and a printing target

A semiconductor chip () is flip-chip mounted on a circuit board () with an underfill resin () interposed between the semiconductor chip () and the circuit board () and a container covering the semiconductor chip () is bonded on the circuit board (). At this point, the semiconductor chip () positioned with the underfill resin () interposed between the circuit board () and the semiconductor chip () is pressed and heated by a pressure-bonding tool (); meanwhile, the surface of the underfill resin () protruding around the semiconductor chip () is pressed by the pressure-bonding tool () through a film () on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness () is formed. The inner surface of the container covering the semiconductor chip () is bonded to the surface unevenness () on the surface of the underfill resin.

Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus

A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.

Method of manufacturing mounting structure and mounting structure

While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

A semiconductor device includes a semiconductor element having a plurality of element electrodes formed thereon, a circuit board having board electrodes respectively corresponding to the element electrodes formed thereon and having the semiconductor element mounted thereon, and bumps each of which is provided on at least one of the element electrode and the board electrode, and connects together the element electrode and the board electrode corresponding to each other when the semiconductor element is mounted on the circuit board. Furthermore, at least one of a dielectric layer and a resistive layer is provided between at least one of the bumps and the element or board electrode on which the at least one of the bumps is provided, so that the element or board electrode, the dielectric layer or the resistive layer, and the bump form a parallel-plate capacitor or electrical resistance.

Semiconductor device having stable signal transmission at high speed and high frequency

An electronic component, in which the outer perimeter portion of a component () is surrounded with a first sealing resin (), a second sealing resin () is filled within the periphery of the first sealing resin (), the component () and a board () are electrically connected by a wire (), the edge, in the vicinity of which the wire () passes, of the outer perimeter edge portions of the component () is formed to be a chamfered oblique surface (), and the wire () is provided to extend to the board () along the oblique surface (). By this means, the overall height of the electronic component can be kept low.

Resin sealing structure for electronic component and resin sealing method for electronic component

A flip-chip mounting apparatus has a shield film () on the side of a pressurizing film () of a tool protection sheet (). When a semiconductor chip () is heated and pressurized via the tool protection sheet (), the pressurizing film () is released from a mold by a sheet fixing jig (), and is expanded by a pressurizing/heating tool () to abut against an insulating resin film () protruding from the periphery of the semiconductor chip () and cure the insulating resin film () with an external pressure being applied.

Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus

A mounting structure of the present invention includes a semiconductor element, a circuit boardhaving electrodesopposed to electrodesof the semiconductor element, and conductive two-layer bumps. Second bumpsjoined to the electrodesof the circuit boardare formed larger than first bumpsjoined to the electrodesof the semiconductor element. The axis of the first bumpand the axis of the second bumpare not aligned with each other.

Mounting structure and mounting method

The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chipmounted on the top surface of the circuit boardoverlaps with the semiconductor chipmounted on the bottom surface of the circuit board, a recess portion(or a protruding portion) is formed in the surfaces of the circuit board

Semiconductor device

A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads () provided on a substrate upper surface (); a plurality of lower side pads () provided on a substrate lower surface () corresponding to the upper side pads () across the substrate (), respectively; a first semiconductor chip () having first bumps () joined to the upper side pads (), respectively; and a second semiconductor chip () having second bumps () joined to the lower side pads (), respectively.

Semiconductor chip assembly and fabrication method therefor

In this semiconductor chip, a table electrodeis interposed between a bump electrodeand an electrode pad. The table electrodeis formed by forming a plurality of coreshaving a smaller Young's modulus than the bump electrode, on the electrode pad, and then covering the surfaces of the coreswith a conductive electrode. When the semiconductor chipis flip-chip mounted, the bump electrodeis plastically deformed and the table electrodeis elastically deformed appropriately, thereby obtaining a good conductive state.

Semiconductor chip and semiconductor device

The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.

Electrode junction structure and manufacturing method thereof

An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.

Growing community of inventors

Osaka, Japan

Kentaro Kumazawa