Tokyo Electron Limited

Kentaro Konishi

Jun Fujihara

Tomoya Endo

Takanori Hyakudomi

Masanori Ueda

Hiroki Shikagawa

Hiroshi Yamada

Hiroaki Hayashi

Kenichi Narikawa

Tetsuya Kagami

Shin Uchida

Xingjun Jiang

Katsuaki Sugiyama

Yukinori Murata

Rika Ozawa

An inspection system includes first and second chiller units which supply first and second heating media controlled to first and second temperatures, respectively, where the second temperature is lower than the first temperature, a stage having a flow passage supplied with a heating medium mixed with the first and the second heating media at a desired mixing ratio, and a controller. The inspection system performs an inspection with respect to a substrate placed on the stage. The controller controls a process of measuring a temperature of the heating medium at an inlet of the flow passage and a temperature of the heating medium at an outlet of the flow passage, and a process of correcting the mixing ratio of the first and second heating media, based on a difference between the temperatures of the heating medium at the inlet and outlet, and a flow rate of the heating medium.

Inspection system and inspection method

A support device includes a support that supports an object to be tested and that includes a flow path inside, the flow path having an inlet and an outlet, and the flow path being configured to flow a first temperature adjusting medium from the inlet to the outlet, a mixer configured to discharge a third temperature adjusting medium, the first temperature adjusting medium flowing out from the outlet and a second temperature adjusting medium externally supplied being mixed at a ratio that is predetermined in the third temperature adjusting medium, a medium transfer configured to transfer the third temperature adjusting medium to the inlet as the first temperature adjusting medium, and a heater configured to heat the first temperature adjusting medium or the third temperature adjusting medium.

Support device, test system, and method of controlling support device

An inspection apparatus for a substrate, comprising: a placing member on which a substrate is placed; a holder configured to hold a probe card having probes; positioning members to be in contact with an upper surface of the placing member to define a height of the placing member with respect to the probes; an adjustment mechanism configured to adjust heights of the positioning members; a detection device; and a control. The controller is configured to execute: positioning the positioning member to a reference height at which an overdrive amount becomes zero, based on the detection results of the probes, the placing member, and the positioning member; and acquiring a height of the positioning member at which a desired overdrive amount is obtained, and raising the placing member while adjusting a driving amount of the adjustment mechanism until the placing member reaches the height.

Inspection apparatus and inspection method

A test system that is compatible with multiple specifications while maintaining a footprint is provided. The test system includes a plurality of test chambers, each test chamber of the plurality of test chambers including a test head used when a substrate on a stage is tested, and a heating medium supply configured to supply a heating medium to the stage. The heating medium supply is disposed in an area lower than a test area in which the plurality of test chambers are disposed.

Test system

A method for releasing contact between probes and a substrate is provided. In a state where the probes are pressed against the substrate to be in contact with the substrate, a pressure is reduced in an inspection space that is surrounded by a substrate support having thereon the substrate, a tubular member attracting and holding the substrate support through a seal member, and a frame to which a probe card is fixed. The method includes raising an alignment mechanism to a predetermined position to be close to the substrate support, subsequently stopping the pressure reduction of the inspection space and supporting the substrate support by the alignment mechanism located at the predetermined position while preventing release of the contact, subsequently lowering the alignment mechanism supporting the substrate support to release the contact, and subsequently stopping the attracting and holding of the substrate support by the tubular member.

Contact release method in inspection apparatus and inspection apparatus

A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Testing system

A testing apparatus includes multiple testing units arrayed in a first axial direction in plan view, the multiple testing units being configured to respectively press probes against electronic devices on chucks to test the electronic devices, multiple gas circulating units respectively disposed in areas each corresponding to one or more testing units among the multiple testing units, the multiple gas circulating units respectively including first fans configured to circulate a gas in the areas along a second axial direction in plan view, multiple temperature detecting units configured to respectively detect temperatures of the chucks, and a controller configured to control drive of the first fans of the multiple gas circulating units based on the detected temperatures of the chucks.

Testing apparatus

An inspection apparatus configured to inspect a target object includes an inspector configured to perform an inspection of an electrical characteristic upon the target object; a gas flow source provided within the inspector and configured to generate a gas flow which cools an inside of the inspector; a position adjuster configured to place the target object thereon and perform a position adjustment between the placed target object and the inspector; a housing which accommodates the inspector and the position adjuster in a same space; and a circulation device configured to circulate a gas by the gas flow source between the inside of the inspector and a region where the position adjuster is located within the space, the circulation device including a cooler configured to cool the gas being circulated and a foreign substance remover configured to remove a foreign substance from the gas being circulated.

Inspection apparatus and cleaning method of inspection apparatus

The present disclosure is provided with a probe card and a transfer stage for transferring an inspection target toward the probe card. The transfer stage is provided with a chuck top on which the inspection target is mounted, an aligner configured to be contacted to or separated from the chuck top, and an aligning mechanism for aligning the chuck top with the aligner. The aligning mechanism has radially-expandable positioning pins at a plurality of positions on the upper surface of the aligner, and pin insertion members at positions on the lower surface of the chuck top corresponding to the positioning pins, the pin insertion members having pin insertion holes of which diameters are larger than those of the positioning pins that are not radially expanded. The chuck top is aligned with the aligner by inserting the positioning pins into the pin insertion holes and radially expanding the positioning pins.

Inspection apparatus, inspection system, and aligning method

An inspection device includes a chuck top that holds a wafer, a probe card disposed to face the wafer held by the chuck top and having a plurality of contact probes on a surface facing the wafer, a pogo frame that holds the probe card, a bellows that surrounds the probe card and the contact probes and forms a sealed space when the wafer is close to or in contact with the contact probes, a gas exhaust path configured to depressurize the pressure in the sealed space, and a mechanical stopper that is provided between the pogo frame and the chuck top and restricts the vertical inclination of the chuck top when a predetermined contact is made between the wafer and the contact probes.

Inspection device and contact method

An inspection system includes: an inspection section provided with an inspection part having a plurality of inspection units each including a tester that performs an electrical inspection of an inspection target, and a probe card provided between the tester and the inspection target; and a loader section including an arrangement part in which a storage container for the inspection target is disposed, and a loader that delivers the inspection target between the storage container and the inspection section. The inspection part includes a plurality of inspection unit rows that are formed by arranging the plurality of inspection units in one horizontal direction and arranged in a plurality of tiers in a vertical direction. The arrangement part is provided on an end part side in one direction of the inspection part.

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Yamanashi, Japan

Kentaro Konishi