Kabushiki Kaisha Toshiba

Nippon Chemi-con Corporation

Kentaro Kobayashi

Naofumi Nakamura

Hiroshi Hamasaki

Michihiko Nishigaki

Hiroko Miki

Hideto Furuyama

Yutaka Onozuka

Akihiro Kojima

Hiroshi Uemura

Mizunori Ezaki

Kazuya Ohira

Haruhiko Yoshida

Sadato Hongo

Norio Iizuka

To reduce the occurrence of capacitor mounting failure on a circuit board in the solder reflow process, the capacitor element is housed in the bottomed cylindrical outer case and sealed with a sealing member the open end of the outer case, the lead terminal derived from the capacitor element is formed through the sealing member a capacitor body, a base having a bottom surface portion and a side wall formed so as to surround the outer periphery of the capacitor body with a through hole through which the lead terminal penetrates, a capacitor having a convex portion protruding toward the capacitor body from the inner surface of the side wall, the caulking portion formed by caulking the side surface of the outer case the convex portion is disposed, providing a gap portion between the caulking portion and the convex portion.

Capacitor and method for producing same, and capacitor-mounting method

According to one embodiment, a particle inspection system includes a voltage driving circuit which applies a driving voltage for a particle inspection to a particle inspection chip, a current-voltage conversion circuit which converts, into a voltage signal, a current signal output from the particle inspection chip when the driving voltage is applied to the particle inspection chip, a detection circuit which detects, based on the voltage signal, whether the sample liquid is introduced into a detection region of the particle inspection chip, and an analysis circuit which analyzes the fine particle, in the sample liquid based on the voltage signal. The voltage driving circuit varies the driving voltage based on the detection result of the detection circuit.

Particle inspection system and driving method employed therein

According to one embodiment, a microanalysis chip includes a substrate, a flow channel in which a sample liquid is allowed to flow, the flow channel being provided on a main surface side of the substrate, a reservoir in which the sample liquid is allowed to be stored, the reservoir being provided on a main surface of the substrate, including a bank having a go-around shape and further including a liquid introduction inlet for connection to an end of the flow channel, the liquid introduction inlet being provided on the main surface of the substrate in the bank, and a filter which is provided between the liquid introduction inlet and the end of the flow channel and includes a first micropore for allowing passage of a fine particle in the sample liquid.

Microanalysis chip

One of embodiments is a semiconductor micro-analysis chip for detecting particles in a sample liquid. The chip comprises a semiconductor substrate, a first flow channel provided on the semiconductor substrate to allow the sample liquid to flow therein, a second flow channel provided at a different position from the first flow channel of the semiconductor substrate to allow the sample liquid or an electrolyte solution to flow therein, a contact portion where a portion of the first flow channel and a portion of the second flow channel abut each other or intersect one another with a partition being arranged between the flow channels, and a fine hole provided on the partition of the contact portion to allow the particles to pass therethrough.

Semiconductor micro-analysis chip and method of manufacturing the same

According to one embodiment, a semiconductor micro-analysis chip includes a first flow channel provided with a substrate surface, the flow channel engraved on the substrate into which a sample liquid can flow, micropore provided with a part of the flow channel, a reservoir provided with at least one end of the flow channel, the reservoir engraved on the substrate for inlet and outlet of the sample liquid, and a first electrode provided with a part of the flow channel or of the reservoir. The electrode is disposed from the bottom surface of the flow channel or of the reservoir to the substrate surface, and a side surface which connects the bottom surface and the substrate surface is tapered for reducing a bend in a height direction of the electrode.

According to one embodiment, a semiconductor analysis chip for detecting a particle in a sample liquid includes a semiconductor substrate, a first flow channel provided in a surface portion of the semiconductor substrate, a second flow channel provided in a surface portion of the semiconductor substrate, part of the second flow channel contacting or intersecting the first flow channel, a micropore provided in a contact portion or an intersection of the first and second flow channels, and configured to permit the particle to pass therethrough, a first electrode provided in the first flow channels, a second electrode provided in the second passage, and a third electrode provided in the first flow channel downstream of the first electrode.

Semiconductor analysis chip and particle inspection method

According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.

Analysis package for detecting particles in a sample liquid

According to one embodiment, an analysis package including an analysis chip provided on a main surface of a semiconductor substrate, the chip including a flow channel, both ends of which are open at peripheral parts of the substrate, and a microaperture which is provided in a middle of the flow channel and which allows a particle to pass therethrough, a package board on which the chip is mounted, liquid receivers provided on the package board, the liquid receivers being connected to openings, and electrodes, at least parts of which are provided on parts of bottom surfaces of the liquid receivers, the electrodes being provided at positions corresponding to an upstream side and a downstream side of the microaperture.

Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board

According to one embodiment, an analysis package including a board including an electrical terminal, an analysis chip provided at the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid for particle detection to the detector, and a liquid receiver for introducing the sample liquid into the flow channel, a mold provided to cover the board on which the analysis chip is provided, the mold comprising an opening above the liquid receiver, a first shield layer provided on a back surface of the board, and a second shield layer provided to be attachable and detachable on an opposite side to the analysis chip of the mold, the second shield layer being electrically connected to a part of the electrical terminal.

Analysis package for detecting particles in a sample liquid, and including shield layers

According to one embodiment, a semiconductor analysis microchip configured to detect a fine particle in a sample liquid, including a semiconductor substrate, a first flow channel provided in the semiconductor substrate, to which the sample liquid is introduced, and a pore provided in the first flow channel and configured to pass the fine particle in the sample liquid.

Semiconductor analysis microchip and method of manufacturing the same

An optical interconnection device includes a light-emitting element, a light-receiving element, and an optical waveguide. Both the light-emitting element and the light-receiving element have a layered structure and are formed on a silicon substrate. At least a portion of the light-emitting element is embedded in an insulator. At least a portion of the light-receiving element is embedded in the insulator. The optical waveguide is formed over the insulator, and is optically coupled to the light-emitting element and the light-receiving element by distributed coupling.

Optical interconnection device and method of manufacturing the same

According to one embodiment, a sample detection apparatus including an insulating partition to divide a first and a second region, a pore formed in the partition, a first electrode arranged in the first region, a second electrode arranged in the second region, a power source configured to apply electrical current between the first and second electrode in a state in which a reagent containing a capture substance to be bound to a target and a tag particle bound to the capture substance is introduced into the first region together with a sample, and an electrolyte solution is introduced into the second region, a measurement unit configured to observe a change in a conductive state, and a detection unit to detect presence/absence of the target in the sample based on an observation result.

Growing community of inventors

Tokyo, Japan

Kentaro Kobayashi